| Allicdata Part #: | ATS13760-ND |
| Manufacturer Part#: |
ATS-08A-12-C2-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08A-12-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.78000 |
| 10 +: | $ 3.67794 |
| 25 +: | $ 3.47382 |
| 50 +: | $ 3.26957 |
| 100 +: | $ 3.06520 |
| 250 +: | $ 2.86086 |
| 500 +: | $ 2.65651 |
| 1000 +: | $ 2.60542 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are increasingly being used in the modern world, in both consumer electronic goods and industrial machines alike. ATS-08A-12-C2-R0 is one such application field. This type of heat sink is designed to wick away heat from the surface of a device or a component, utilizing the natural process of convection to dissipate the heat efficiently. While the application fields of the ATS-08A-12-C2-R0 specifically can greatly vary, there are certain universal principles behind how the heat sink remains effective in whatever context it is applied.
In order to understand the working principle of the ATS-08A-12-C2-R0, it is important to understand the basis of convection. Convection is any process that induces the transfer of energy or heat between two particles, typically a gas and the surface of an object. This is done by the inner movement of the gas, which is a result of differences in temperature between the gas and the object.
The ATS-08A-12-C2-R0 works on similar principles, except it uses the same process in reverse. By trapping air within its larger frame, it is able to reduce the amount of exchange of hot air around the device or component. This insulated layer prevents the interior of the device or component from heating up, causing a lack of convection. As a result, the temperature of the device or component remains controlled, preventing overheating.
The primary materials used in the construction of the ATS-08A-12-C2-R0 are aluminum and copper, which have been found to be the best materials available for heat resistance, as well as being comparably lightweight. Aluminum is an excellent heat conductor and will resit the symptoms of thermal fatigue, while copper is the best heat conductor of all metals. In addition, the ATS-08A-12-C2-R0 is resistant to environmental factors, such as condensation and humidity, as well as radiation.
The mounting of the ATS-08A-12-C2-R0 is done using a mounting bracket, which is designed to ensure that the heat sink is fitted perfectly onto the intended device or component. Once correctly installed, it ensures that the flow of air in and out of the device or component is correctly managed and regulated. In addition, the ATS-08A-12-C2-R0 is also designed to be resistant to vibrations and shocks, preventing damage to the device or component.
The ATS-08A-12-C2-R0 is an effective and reliable solution for any application field and situation, and its versatility makes it especially beneficial in some cases. There are a range of temperatures and performance levels at which it can be used, depending on the specific needs of the device or component. As a result, it is often an ideal choice for industrial machines and consumer electronics alike, and it is increasingly being used in both fields.
The specific data is subject to PDF, and the above content is for reference