| Allicdata Part #: | ATS-08A-177-C1-R0-ND |
| Manufacturer Part#: |
ATS-08A-177-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08A-177-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19788 |
| 30 +: | $ 3.11157 |
| 50 +: | $ 2.93857 |
| 100 +: | $ 2.76576 |
| 250 +: | $ 2.59291 |
| 500 +: | $ 2.50647 |
| 1000 +: | $ 2.24717 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-08A-177-C1-R0 is a thermal heat sink designed to optimize and dissipate heat generated by electronic components. Heat can easily accumulate and potentially damage components, making it necessary to use thermal technology such as heat sinks to dissipate heat away from sensitive components. The ATS-08A-177-C1-R0 is designed to conform to any mounting requirements and can be used in a variety of applications.
The ATS-08A-177-C1-R0 uses a thermally conductive material, most commonly an anodized aluminum plate, to draw heat away from components by slightly decreasing the temperature of the surrounding air. This method of heat transfer is known as conduction. The aluminum plate of the ATS-08-177-C1-R0 is shaped into fins that allow for better heat dissipation and airflow. The heat sink typically comes with a fan installed onto the top of the heatsink as an additional form of cooling.
The ATS-08A-177-C1-R0 can be used in a variety of thermal applications. The most common application for this heat sink is in computer components such as central processing units, graphic cards, and power supply electronic components. It can also be used for cooling in communications hardware, automobile electronic devices, and industrial control systems. The ATS-08A-177-C1-R0 provides consistent thermal performance and protection against thermal shock.
The ATS-08A-177-C1-R0 is designed with an optimized fan mount to ensure silent operation. The fan is powered by a 4-pin connector and runs at a maximum speed of up to 2800 RPM. The fan is designed with anti-vibration technology and is capable of providing up to 11.4 CFM of airflow. This helps to increase the cooling efficiency of the heat sink and ensure the components are properly cooled.
The ATS-08A-177-C1-R0 is also designed with a unique fin profile design that helps to reduce noise from turbulence. This also helps to reduce the static pressure of the fan and keep the noise level down. The heatsink also has a mounting bracket that allows for compatibility with a number of different mounting styles.
The ATS-08A-177-C1-R0 thermal heat sink is designed to be reliable and efficient. It provides a consistent and reliable thermal performance and is designed with a unique fin profile design and optimized fan mount. This heat sink is suitable for a variety of applications and is capable of providing efficient cooling to sensitive electronic components.
The specific data is subject to PDF, and the above content is for reference