| Allicdata Part #: | ATS-08A-37-C3-R0-ND |
| Manufacturer Part#: |
ATS-08A-37-C3-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08A-37-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are used to disperse and cool electronic components that generate large amounts of heat. Among them, ATS-08A-37-C3-R0 is a particularly efficient type. The basic application field and working principle of ATS-08A-37-C3-R0 thermal-heat sink is explained as follows.
Application Field of ATS-08A-37-C3-R0
ATS-08A-37-C3-R0 thermal-heat sink is designed to work with high wattage resistive and inductive loads, and AC/DC inductor-capacitor combinations. In addition, it is capable of operating in a wide temperature range, from -40℃ to 125℃ (-40℉ to 257℉). This makes it suitable for applications in various industrial fields such as automotive, medical, military, and consumer electronics.
Working Principle of ATS-08A-37-C3-R0
The working principle of ATS-08A-37-C3-R0 lies in its unique construction. This thermal-heat sink is built with a coated aluminum base that is bonded with multiple fins. The fins serve as dissipators for the heat generated by the components. As the fins attract heat away from the attached components, the heat is then channeled into the environment. The aluminum base and fins can also act as a conductor, increasing the cooling capability of the ATS-08A-37-C3-R0.
The increased surface area of the fins allows more efficient heat conduction, and also increases the rate at which heat is dissipated. The optimized fin construction also helps reduce the air flow resistance and promotes heat extraction. With its excellent cooling capability, this thermal-heat sink has proven to be an asset in high-power applications.
Conclusion
The ATS-08A-37-C3-R0 thermal-heat sink is an ideal solution for managing and dispersing heat in electronic components. Its combined aluminum base and fins provide efficient heat conductivity and increased heat-dissipating surface area. Therefore, it can be used in a wide range of applications, including automotive, medical, military, and consumer electronics products.
The specific data is subject to PDF, and the above content is for reference