| Allicdata Part #: | ATS-08A-50-C1-R0-ND |
| Manufacturer Part#: |
ATS-08A-50-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-08A-50-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management and heat management are important components of many electronic systems. In order to maintain most electronic systems, efficient cooling technologies must be used. One type of cooling device that is widely used in many industries is the heat sink. Today, heat sinks are available in a variety of designs and sizes, ranging from small form factor (SFF) to large form factor (LFF) heat sinks.
The ATS-08A-50-C1-R0 is a robust thermal management device that is suitable for use in many applications. The device is equipped with a large aluminum heat sink that can dissipate up to 50 W of power. It also includes a circulatory system which can transfer heat away from the heat sink surface and dissipate it into the environment.
The ATS-08A-50-C1-R0 can be used for many applications, including cooling applications in consumer electronics, industrial machinery, telecommunication systems, military systems, and medical applications. It is also suitable for controlling the temperature of hot computing systems, server cabinets, and other high-performance devices. Additionally, the device is used to dissipate the power from high-power audio amplifiers, and radio frequency (RF) transceivers.
The ATS-08A-50-C1-R0 works by dissipating the heat generated by electronics components into the air using a heat sink. This device incorporates an innovative design, which creates an efficient cooling system that can dissipate up to 50 watts of power. It uses a fan to draw in air through the heat sink and then circulates it around the heating elements. The air is then expelled through the outlet vents to cool the device.
The ATS-08A-50-C1-R0 heat sink features a large aluminum heat sink which helps to dissipate heat quickly and efficiently. It is constructed from heavy-duty aluminum and is designed to provide ample cooling capabilities and superior thermal management for a variety of applications. Additionally, the integrated temperature controls of the device ensure that the maximum temperatures are not exceeded, and any unexpected temperature changes are managed quickly and safely.
The ATS-08A-50-C1-R0 heat sink is an ideal device for applications that require effective thermal management solutions. It offers reliable performance, superior cooling capabilities, and efficient temperature control. It is designed for applications which may need to dissipate up to 50 watts of power, and can be used in a variety of industries and applications. With its advanced design and reliable performance, the ATS-08A-50-C1-R0 heat sink is an ideal thermal management solution for many applications.
The specific data is subject to PDF, and the above content is for reference
ATS-08A-50-C1-R0 Datasheet/PDF