| Allicdata Part #: | ATS-08A-65-C1-R0-ND |
| Manufacturer Part#: |
ATS-08A-65-C1-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08A-65-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is the process of controlling the rate at which heat is generated and dissipated in a system. Heat sinks are an important component of thermal management systems. They are designed to dissipate heat away from heat-generating components and can significantly reduce system temperatures. The ATS-08A-65-C1-R0 is a popular heat sink in the thermal management industry.
The ATS-08A-65-C1-R0 has many applications in a range of industries and across a wide variety of electronic components. It is often used in consumer electronics to cool circuit boards, as well as televisions, gaming consoles, and other small electronic devices. It is also commonly used in industrial applications, such as industrial robotics, medical imaging, and automotive component cooling.
The ATS-08A-65-C1-R0 heat sink has a thermal resistance of 0.8C/W, making it one of the most efficient heat sinks on the market. It features a thin profile, with fins that are just 0.127mm thick. This makes the ATS-08A-65-C1-R0 an ideal solution for applications where space is at a premium. It is also designed to be compatible with standard mounting hardware.
The ATS-08A-65-C1-R0 heat sink utilizes a combination of air convection, direct contact, and vapor chamber techniques to facilitate heat dissipation. The design of the ATS-08A-65-C1-R0 utilizes a thin-fin array to maximize surface area and facilitate air circulation. Heat is transferred to the fin array via direct contact or via the vapor chamber effect. Air circulation is then used to dissipate the heat away from the component. The design of the ATS-08A-65-C1-R0 results in improved performance and efficiency.
The ATS-08A-65-C1-R0 heat sink is a reliable and efficient thermal management solution for a wide range of applications. Its thin-fin design and high thermal resistance make it suitable for compact spaces, while its combination of air convection, direct contact, and vapor chamber techniques make it an ideal solution for managing temperatures in small electronic components.
The specific data is subject to PDF, and the above content is for reference