| Allicdata Part #: | ATS-08A-70-C3-R0-ND |
| Manufacturer Part#: |
ATS-08A-70-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08A-70-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of modern technology. This is especially important in the world of electronics, where heat can cause electronic components to fail. The ATS-08A-70-C3-R0 thermal- heat sink is specifically designed to provide effective cooling and heat transfer for electronics.
The ATS-08A-70-C3-R0 is a heat sink that is designed to fit on a variety of electronic components. It is constructed of an aluminum alloy material with a large fin configuration. This heat sink is mounted directly onto the component to be cooled. The fins provide ample surface area which allows the component to be cooled more efficiently. Additionally, the fin design and aluminum alloy help to dissipate heat much faster than other materials. The aluminum alloy is also highly corrosion-resistant, which provides additional protection for the electronic components.
The ATS-08A-70-C3-R0 heat sink is most commonly used in applications such as Peltier devices, power ICs, and CPUs. The fins are specifically designed to provide adequate heat dissipation to prevent the electronic components from overheating. Additionally, the heat sink helps to protect the components from damage that may occur from prolonged exposure to high temperatures. In these applications, the ATS-08A-70-C3-R0 can help to increase the reliability and extend the life of the electronic components.
The ATS-08A-70-C3-R0 also features an improved design for easy installation. This heat sink utilizes an array of screws to secure it to the component. The design ensures the heat sink will stay in place, no matter how the component is handled. This makes the installation of the heat sink easier and helps to ensure that it will stay in place.
The working principles of ATS-08A-70-C3-R0 heat sink are based on the laws of thermodynamics. When heat is placed on an electronic component, it is transferred from the component to the heat sink through conduction. The heat is then dispersed by the air cooling fins, allowing the component to maintain a lower temperature. The process of heat dissipation is based on the concept of entropy. The more heat that is dissipated, the more entropy is created. This entropy then reduces the temperature of the component, thus providing a cooling effect.
The ATS-08A-70-C3-R0 is a great choice for anyone looking for an effective thermal-heat sink for their electronic components. Its broad range of applications, easy installation, and increased efficiency make it one of the best choices on the market. The ATS-08A-70-C3-R0 is sure to provide reliable and efficient cooling for any electronic component.
The specific data is subject to PDF, and the above content is for reference