ATS-08A-81-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.22°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks Thermal - Heat Sinks are appliances intended to dissipate heat from an electronic component or device. In contrast to other cooling methods such as convection, thermal-heat sinks use a solid material to transfer thermal energy away from the electrical components. The use of a thermally conductive metal component allows for greater dissipation of heat and prevention of associated temperature-related problems in the device.ATS-08A-81-C3-R0 Application Field and Working PrincipleThe ATS-08A-81-C3-R0 heat sink is a high performance thermally conductive aluminum component designed to dissipate heat from electronics components and devices. The special air-cooled aluminum fin design of the ATS-08A-81-C3-R0 increases the thermal conductivity by approximately 20% as compared to traditional types of heat sinks. The aluminum fins are arranged in a radial pattern with two main aims: to maximize the surface area of the heat sink and to maintain minimal spacing between the fins.The ATS-08A-81-C3-R0 heat sink is designed to work as a natural convection-cooled device. Heat is conducted away from the source component to the surface of the heat sink where it is dispersed through the air-cooled fins. As the heat dissipates, the air leaves the fins heated and rises away from the heat sink. This process is continuous and provides effective cooling of the components.The ATS-08A-81-C3-R0 heat sink is therefore ideal for applications where high thermal performance is required. It is highly suitable for applications such as lighting, computer components, industrial electronics, power modules and telecoms equipment. The heat sink is highly efficient and provides excellent thermal performance, which makes it an ideal choice for temperature-sensitive components.The ATS-08A-81-C3-R0 heat sink also works well in situations where space is limited. It is compact and lightweight, which makes it easy to use in applications with tight space constraints. Moreover, the device is engineered to fit directly into an application, eliminating the need for additional heat-sink mounting hardware.Overall, the ATS-08A-81-C3-R0 heat sink is a high performance thermally conductive aluminum component designed to dissipate heat from electronics components and devices. Its special design increases the thermal conductivity by 20%, providing superior cooling capabilities. It is the perfect choice for temperature-sensitive components, and its compact size makes it a great choice for applications with tight space constraints.

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