| Allicdata Part #: | ATS-08B-114-C1-R0-ND |
| Manufacturer Part#: |
ATS-08B-114-C1-R0 |
| Price: | $ 3.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08B-114-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.86524 |
| 30 +: | $ 2.78754 |
| 50 +: | $ 2.63277 |
| 100 +: | $ 2.47785 |
| 250 +: | $ 2.32301 |
| 500 +: | $ 2.24557 |
| 1000 +: | $ 2.01326 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.38°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are cooling components used to transfer heat away from fragile parts and components of electronics and other machinery in order to extend their lifespans. Heat sinks come in many different forms, each intended for a specific application, and one popular type of heat sink is the ATS-08B-114-C1-R0. This article will discuss the application field and working principle of the ATS-08B-114-C1-R0 heat sink in detail.
ATS-08B-114-C1-R0 Application Field
The ATS-08B-114-C1-R0 is a compact heat sink designed for use in small form factor applications such as medical, industrial, and computer hardware. It offers a thermal resistance of 1.3 °C/W and is suitable for cooling a variety of electronic components and devices. It is compatible with both traditional and contemporary form factors, including PCs, laptops, tablets, and embedded boards.
The ATS-08B-114-C1-R0 is primarily designed for cooling processors and ICs, and is also suitable for cooling power supply modules, LED modules, and other electronic components. It mounts securely and firmly, making it suitable for any application requiring a small form factor cooling solution.
ATS-08B-114-C1-R0 Working Principle
The ATS-08B-114-C1-R0 heat sink works by absorbing the heat generated by electronic components and dissipating it away from the devices or components. This is done by an assembly of fins that are designed to maximize the thermal interface between the heat sink and the device or components it is cooling. The fins are sprayed with a layer of rubbing oil, which helps the thermal flux rate to smoothly transfer from the heat sink to the components. The ATS-08B-114-C1-R0 also utilizes a radial fin assembly, which has broader fin surfaces resulting in better thermal distribution.
The ATS-08B-114-C1-R0 also uses a copper base and a solid aluminum heat sink body. The copper base helps absorb heat from the processor quickly and evenly, as copper has an excellent heat absorption rate. The aluminum body is durable and offers excellent thermal conductivity. The copper base is also connected to the aluminum body via an extruded heat pipe, which helps draw heat away from the copper base quickly. The heat pipe is also coated with a layer of copper, which increases the heat pipe\'s thermal conductivity and helps with heat dissipation.
Finally, the ATS-08B-114-C1-R0 comes with a fan bracket and a 40mm fan to provide additional cooling. The fan bracket can be mounted anywhere on the heat sink and can be adjusted to provide optimal airflow. The fan helps pull additional hot air away from the components, creating a stronger air flow and allowing the heat sink to do its job more effectively.
Conclusion
The ATS-08B-114-C1-R0 is a great choice for applications requiring a small form factor cooling solution. It offers excellent thermal performance, a durable body, and a fan bracket for extra cooling. By utilizing the thermal properties of copper, the thermal interface of rubbing oil, and the airflow from the fan, it dissipates heat quickly and effectively, thus increasing the lifespan of the electronic components it is cooling.
The specific data is subject to PDF, and the above content is for reference