| Allicdata Part #: | ATS-08B-117-C3-R0-ND |
| Manufacturer Part#: |
ATS-08B-117-C3-R0 |
| Price: | $ 3.46 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08B-117-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.14307 |
| 30 +: | $ 3.05802 |
| 50 +: | $ 2.88817 |
| 100 +: | $ 2.71826 |
| 250 +: | $ 2.54838 |
| 500 +: | $ 2.46344 |
| 1000 +: | $ 2.20860 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are components that are used to dissipate heat from components or devices by transferring the heat away from the component or device to a heat sink, which is typically air- or liquid-cooled. The ATS-08B-117-C3-R0 is an example of a heat sink. This heat sink has a number of applications and its working principle is based on the basic laws of thermodynamics.
Application Field
The ATS-08B-117-C3-R0 is a relatively small heat sink, measuring about 117 mm in length and designed for use with multiple PCBs and modules. It is typically used in applications such as consumer electronics, industrial automation, broadcasting, and automotive electronics, where heat needs to be dissipated from a device or component without any additional cooling medium, such as air or liquid. Another common application is in power supplies, which often require additional cooling to ensure optimal performance.
Working Principle
The working principle of the ATS-08B-117-C3-R0 heat sink is based on the principles of thermodynamics. The heat sink works by conducting heat away from the component or device that is producing it. As heat is conducted away from the device, the temperature of the device reduces. This is because heat moves from warmer areas to cooler areas. The cooler the air surrounding the device, the easier it is for heat to be conducted away. The ATS-08B-117-C3-R0 is designed with an aluminum base plate, which is connected to a number of finned aluminum extrusions. The extrusions increase the surface area of the heat sink, which allows more air circulation, and therefore more heat to be conducted away from the device.
Being able to control the temperature of a device is important, as it allows the device to function optimally. If the temperature of the device exceeds the maximum allowable temperature, then it can damage the device or reduce its lifespan. ATS-08B-117-C3-R0 heat sinks are designed to help keep the temperature of the device within an acceptable range, allowing it to operate without issue for a longer period of time.
Conclusion
The ATS-08B-117-C3-R0 is an example of a heat sink, which is designed to help dissipate heat away from components or devices. It is typically used in consumer electronics, industrial automation, broadcasting, and automotive electronics applications, where heat needs to be dissipated without the use of additional cooling. The working principle of the ATS-08B-117-C3-R0 is based on the basic laws of thermodynamics, whereby heat is conducted away from the device to a cooler area. By providing efficient heat dissipation, operating temperatures can be maintained at optimal levels, maximizing the lifespan of the device or component.
The specific data is subject to PDF, and the above content is for reference