| Allicdata Part #: | ATS-08B-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-08B-12-C3-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08B-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.53934 |
| 30 +: | $ 3.34257 |
| 50 +: | $ 3.14584 |
| 100 +: | $ 2.94928 |
| 250 +: | $ 2.75265 |
| 500 +: | $ 2.55602 |
| 1000 +: | $ 2.50686 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - heat sinks are an important measure of heat dissipation in many electronic components, providing cooling to maintain a system\'s proper running temperature. ATS-08B-12-C3-R0 is a thermal - heat sink created specifically for electronics applications. It features excellent cooling performance, robust construction and a reduced installation size, making it an ideal choice in many applications.
Overview of ATS-08B-12-C3-R0
The ATS-08B-12-C3-R0 is a thermal - heat sink designed for cooling components in a range of applications. The device has been specifically designed for use in electronic equipment and computer systems. It is characterized by high efficiency, low installation size and robust construction.
The ATS-08B-12-C3-R0 thermal - heat sink is a multi-layer copper plate that limits heat transmission between the laptop and its environment, ensuring efficient heat dissipation. The unit is fitted with aluminum fins that push out the heat quickly. Furthermore, the thermal - heat sink features a thin high thermal conductive material between the aluminum fins to enhance heat transfer. Additionally, it comes with foam and silicone glues to assist in mounting the sink to the device. As a result of its construction, it can handle a shock load of up to 50G.
Application Field of ATS-08B-12-C3-R0
The ATS-08B-12-C3-R0 was designed for cooling components in a range of electronic products such as laptop computers, gaming consoles, servers, and other devices. With its small installation size, it can fit into a variety of parts, making it suitable for tight spaces. Its robust construction ensures that it can handle shock and vibration, making it more reliable in tough conditions.
Additionally, the ATS-08B-12-C3-R0 has a low profile which allows it to be used to cool components in systems where the amount of space is limited, such as on portable devices. In such cases, the thermal - heat sink\'s low profile and light weight ensure that it does not interfere with other components within the system. The device also has a low profile and light weight which makes it ideal for use in laptops and other notebook computers.
Apart from cooling components in electronic equipment, the ATS-08B-12-C3-R0 is also used for server cooling, as its cooling efficiency makes it a suitable option for servers. For servers that require higher thermal loads, the aluminum fins provide efficient heat dissipation, ensuring that the system runs at optimal temperature. In addition, its reduced installation size and low weight makes it ideal for servers that come with limited space for components.
Working Principle of ATS-08B-12-C3-R0
The ATS-08B-12-C3-R0 operates on a simple principle. Firstly, the copper plates that form the base are fitted with aluminum fins. These fins act as heat sinks, absorbing and dissipating the heat that would otherwise affect the system components. The fins are separated by high thermal-conductive material, which helps transfer the heat away from the device and to the fins quickly. This helps ensure that the device is operating at its optimal temperature.
The aluminum fins have been designed to maximize the heat dissipation rate, allowing the device to get rid of the heat faster. Additionally, the fins and the plate base are designed to enable efficient cooling, ensuring that no heat is left behind in the device. The air passing through the fins is further improved by the silicone and foam glues set up between the fins and the base plate, creating a good air flow path.
Conclusion
The ATS-08B-12-C3-R0 is an excellent thermal - heat sink designed specifically for electronic products and systems. It is characterized by robust construction, small installation size and excellent cooling performance, making it an ideal choice for demanding environments. With its efficient working principle and ability to perform in tight spaces, it is an optimal choice for many applications.
The specific data is subject to PDF, and the above content is for reference