ATS-08B-134-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS13974-ND

Manufacturer Part#:

ATS-08B-134-C2-R0

Price: $ 7.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X15MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08B-134-C2-R0 datasheetATS-08B-134-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.58350
10 +: $ 6.40773
25 +: $ 6.05203
50 +: $ 5.69596
100 +: $ 5.34001
250 +: $ 4.98401
500 +: $ 4.62801
1000 +: $ 4.53900
Stock 1000Can Ship Immediately
$ 7.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an important component in many electronic devices used in a wide range of applications. The ATS-08B-134-C2-R0 is a reliable and powerful heat sink that is widely used for dissipating heat from various electronic components. This article will provide an introduction to the application field and working principle of the ATS-08B-134-C2-R0 heat sink.

The ATS-08B-134-C2-R0 is a highly efficient heat sink that is designed for dissipating thermal energy from electronic components in a wide range of applications. It has a high level of performance with a good surface area-to-volume ratio and high-quality materials that helps to increase the dissipation capability. It is also capable of providing excellent thermal stability and reliability, ensuring that sensitive components experience minimal thermal load.

The ATS-08B-134-C2-R0 heat sink is commonly used in computers, telecommunication devices, audio and video equipment, medical devices, automotive electronics, and various other devices. It is designed to provide superior thermal management for devices that require reliable and efficient cooling. The heat sink is usually placed in direct contact with the components that require cooling and is designed to dissipate the heat away from the device.

The ATS-08B-134-C2-R0 heat sink features a unique design in which the fins are arranged in a staggered pattern to increase surface area. This increases the dissipating capability of the heat sink, allowing it to handle larger amounts of heat. The heat sink also features a copper-nickel powder coating that helps to provide superior corrosion resistance and superior thermal conductivity. The coating also helps to reduce EMI (Electromagnetic Interference) and minimize noise.

The working principle of the ATS-08B-134-C2-R0 heat sink is based on the principle of natural convection. When the device is powered on, the heat generated by the electronic components is transferred to the heat sink and diffused by the fins. The air surrounding the fins is heated and rises up due to the decrease in air density, and is replaced by cooler air. This creates a convection flow that cools the device by carrying the heat away from the surface and dissipating it into the atmosphere.

The ATS-08B-134-C2-R0 heat sink is an excellent option for cooling various electronic components. It offers superior thermal management capabilities and excellent performance, making it suitable for use in a wide range of applications. The design and working principle of the heat sink ensures efficient and reliable cooling, making it an ideal choice for anyone looking to invest in a quality thermal solution.

The specific data is subject to PDF, and the above content is for reference

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