| Allicdata Part #: | ATS-08B-143-C1-R0-ND |
| Manufacturer Part#: |
ATS-08B-143-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08B-143-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays a critical role in developing and sustaining modern and advanced electronic equipment. It is the science of managing heat transfer in and out of a device, ensuring that it can operate in its optimal state. The ATS-08B-143-C1-R0 Heat Sink is a highly effective and versatile solution for efficient thermal management, designed to maximize performance and reliability.
Designed to be used in a wide variety of applications, the ATS-08B-143-C1-R0 Heat Sink offers a number of advantages, including increased overall performance, improved thermal management, and low cost operation. It is an effective heat transfer device, designed to provide reliable cooling for many types of electronic systems.
The ATS-08B-143-C1-R0 Heat Sink consists of an aluminum base, contact pin, gripper, counterbores, and a thermally efficient copper heat sink. It is a passive heat management component that dissipates heat by natural air convection. The heat sink is designed to be used in conjunction with other heat management devices such as blowers and fans, which act as airflow boosters. The airflow created by these devices increases the efficiency of the heat sink. The heat sink also features a unique design that allows it to be mounted at any angle, providing greater flexibility for thermal management solutions.
The ATS-08B-143-C1-R0 Heat Sink uses the natural properties of a material that is able to absorb thermal energy. This thermal energy is then absorbed by the fins of the heat sink, thus transferring thermal energy away from the device. The fins are made of a material that is thermally conductive, allowing it to effectively disperse the heat away from the device. The thermal energy is then dissipated into the air, helping to maintain a cool environment.
The ATS-08B-143-C1-R0 Heat Sink is designed for use in a wide variety of applications including computers, gaming machines, and consumer electronics. It is ideal for use in high performance applications, providing excellent capital efficiency. The heat sink is also designed to withstand high temperatures, making it suitable for applications where high temperatures are a concern.
The ATS-08B-143-C1-R0 Heat Sink is a cost-effective solution for efficient and reliable thermal management. It is designed to be a highly effective and versatile solution for providing reliable cooling systems for many types of electronic systems. The heat sink is able to effectively dissipate thermal energy, providing an efficient and reliable cooling solution. As a result, it is an ideal choice for those looking to maximize their performance and reliability.
The specific data is subject to PDF, and the above content is for reference