| Allicdata Part #: | ATS-08B-15-C1-R0-ND |
| Manufacturer Part#: |
ATS-08B-15-C1-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08B-15-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components in a wide range of applications from electronics to plumbing, because they help dissipate unwanted heat. The ATS-08B-15-C1-R0 is a thermal heat sink that is designed to help dissipate heat by transferring the thermal energy away from its source and into the environment.
Its construction includes a series of aluminum fins that are spread apart to create an array of heat-absorbing surfaces that act as heat sinks. The design of this heat sink also provides a surface area for convection that can be increased with higher airflow. The heat-sink is designed to be mounted on the processor or other heat-generating components, and the connection is done with thermal pads or heatsink paste.
The ATS-08B-15-C1-R0 is an excellent choice for processors or other heat-generating components, as it helps dissipate a large amount of heat quickly. It is able to dissipate more than 15W of power, while ensuring that the temperature of the chip remains relatively low. The ATS-08B-15-C1-R0 also features a low profile design, which reduces the overall weight of the thermal heat sink to a minimum.
The thermal heat sink from ATS-08B-15-C1-R0 is designed with thermal performance in mind. It is made of aluminum, which has a high thermal conductivity, enabling it to quickly dissipate large amounts of heat. The heat-sink also features a unique construction that helps create a large surface area for convection, providing maximum heat transfer. In addition, the heat-sink has an efficient heat distribution network that allows for the most efficient transfer of heat.
In addition to its cooling capabilities, the ATS-08B-15-C1-R0 also offers the user the ability to monitor the performance of the processor, by monitoring the temperature of the chip. This enables the user to effectively control the processor temperature and optimize performance. As a result, the processor will run at its peak performance without the risk of overheating.
The ATS-08B-15-C1-R0 thermal heat sink is designed to offer maximum thermal performance with a minimum of resources. It is easy to install and is designed to provide reliable and efficient cooling for any processor or other heat-generating component. It also features a sleek and modern design, making it an attractive choice for any application, from electronics to plumbing, that requires reliable and efficient cooling.
The specific data is subject to PDF, and the above content is for reference