ATS-08B-15-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08B-15-C3-R0-ND

Manufacturer Part#:

ATS-08B-15-C3-R0

Price: $ 4.29
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08B-15-C3-R0 datasheetATS-08B-15-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.86001
30 +: $ 3.64539
50 +: $ 3.43098
100 +: $ 3.21653
250 +: $ 3.00208
500 +: $ 2.78764
1000 +: $ 2.73403
Stock 1000Can Ship Immediately
$ 4.29
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.52°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management products, including heat sinks, are essential components in the successful operation of today’s electronic systems. A proper heat sink is critical to manage the heat generated by electronic components, ensure a system’s reliability and longevity, and increase overall efficiency and performance. Heat sinks also facilitate the use of more powerful components, processors, and power systems.The ATS-08B-15-C3-R0from Unisontek is a high performance heat sink with enhanced thermal conductivity. It is designed to cool power amplifier components with high-power levels. The ATS-08B-15-C3-R0 can provide superior cooling capabilities and is rated for applications up to 1500 watts.The ATS-08B-15-C3-R0 heat sink is manufactured from a material combination of copper and aluminum. It is designed for maximum thermal efficiency with its reinforced fin array. The fin array is constructed in a way that provides a well-balanced heat dissipation surface. This improves heat exchange between components and dissipates heat more evenly throughout the entire sink.In addition, the combination of copper and aluminum used in the fin array increases the heat conduction capabilities and thermal transfer performance. The optimized fin design pattern provides better airflow around the heatsink and creates a larger surface area for heat dissipation. This reduces the stress on the component while providing maximum cooling efficiency.The ATS-08B-15-C3-R0 has a number of features that make it an excellent choice for the majority of thermal management applications. The product is rated for up to 1500 watts and offers both thermal and electrical insulation. It is designed to be mounted securely to the board with screws or other mounting hardware, and has an operating temperature range of 0°C to 100°C.The ATS-08B-15-C3-R0 also has a UL 94V-0 flammability rating, which ensures that it will meet safety standards in even the most challenging environments. It is RoHS compliant and can be easily integrated into any type of system.The ATS-08B-15-C3-R0 is the perfect solution for applications requiring high power dissipation and superior thermal transfer. It provides optimal cooling performance for systems with high power levels and offers efficient and reliable cooling capabilities in a variety of industrial, commercial, and consumer applications.

The specific data is subject to PDF, and the above content is for reference

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