| Allicdata Part #: | ATS-08B-154-C3-R0-ND |
| Manufacturer Part#: |
ATS-08B-154-C3-R0 |
| Price: | $ 3.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08B-154-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.60801 |
| 30 +: | $ 3.40746 |
| 50 +: | $ 3.20695 |
| 100 +: | $ 3.00655 |
| 250 +: | $ 2.80610 |
| 500 +: | $ 2.60565 |
| 1000 +: | $ 2.55554 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management components, such as heat sinks, are essential parts of modern electronics. Heat sinks absorb and dissipate heat from components and circuitry, making them more efficient and reliable. The ATS-08B-154-C3-R0 is a high-performance thermoelectric heat sink designed for thermal management in high-power electronics. Here, we will discuss the application and working principle of this heat sink.
The ATS-08B-154-C3-R0 is a thermoelectric heat sink designed to handle long-term temperatures ranging from -30 oC to 150 oC. The thermal design allows for uniform temperature distribution across the entire heat sink, ensuring optimal cooling performance. The ATS-08B-154-C3-R0 heat sink is designed with an integrated mounting plate, which allows for easily connecting the device to a circuit board or other substrate. The heat sink is suitable for use in various industries, including aerospace, industrial, and automotive applications.
Theworking principle of the ATS-08B-154-C3-R0 heat sink is based on the Peltier effect. The Peltier effect describes how a temperature difference is created when an electric current passes through a junction of two conductors. This effect creates a heat flow between the two conductors, which can be used to dissipate heat from a component or heat sink. In the ATS-08B-154-C3-R0, the heat is dissipated from the device to the ambient environment.
The heat capacity of the ATS-08B-154-C3-R0 heat sink is also quite impressive. It has a maximum heat dissipation of up to 40W, ensuring it can handle high-power components. The heat sink also features an efficient, low-resistance thermal design, which allows for optimal heat transfer in extreme temperatures. Finally, the heat sink features a sturdy construction and is Corrosion resistant, making it ideal for use in harsh, industrial environments.
The ATS-08B-154-C3-R0 thermal heat sink is a high-performance, thermoelectric device designed specifically for thermal management in high-power electronics and other applications. Its integrated mounting plate ensures easy installation, while its low-resistance thermal design ensures maximum heat transfer efficiency. Furthermore, the heat sink features a maximum heat dissipation of up to 40W, which makes it suitable for handling high-power components. All in all, the ATS-08B-154-C3-R0 thermal heat sink is an effective and reliable solution for thermal management in a variety of industries.
The specific data is subject to PDF, and the above content is for reference