| Allicdata Part #: | ATS14014-ND |
| Manufacturer Part#: |
ATS-08B-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08B-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to disperse heat away from an object or surface. This helps prevent the object or surface from getting too hot due to the thermal energy. The ATS-08B-170-C2-R0 is a type of heat sink specifically designed for thermal management applications. This article will discuss the application field and working principle of the ATS-08B-170-C2-R0.
The ATS-08B-170-C2-R0 is a low profile design that is suitable for applications with limited space. The device measures only 8 mm x 17 mm x 5 mm and is easy to install with a surface mounting fixture. The heat sink features a black anodized top fin that provides excellent thermal performance and a long service life. The bottom fins are electroplated to provide corrosion resistance and to ensure a smooth finish.
The ATS-08B-170-C2-R0 is designed to provide heat dissipation for a variety of electronics applications. This includes LED lights, appliances, and high-power electronics. Because of its low profile design, the ATS-08B-170-C2-R0 is also suitable for tight spaces such as mobile devices.
The ATS-08B-170-C2-R0 features a thermal pad, which is a thin layer of thermally conductive material. The thermal pad helps to transfer heat away from the object or surface that it is attached to. This helps to keep the object or surface from getting too hot due to the thermal energy. The thermal pad is made of a silicone-based material that can dissipate heat quickly and effectively.
The ATS-08B-170-C2-R0 is an extruded aluminum heat sink that features fins that can help increase the surface area of the device. The fins help to transfer heat away from the object or surface by creating an increased surface area for heat dissipation. This helps to keep the object or surface from overheating due to the increased amount of surface area that can dissipate the thermal energy.
The ATS-08B-170-C2-R0 also features a unique airflow design that helps to improve the thermal performance of the device. The airflow design helps to create an air pocket that can help to dissipate heat away from the object or surface. This helps to keep the object or surface from becoming too hot due to the thermal energy.
In summary, the ATS-08B-170-C2-R0 is a thermal management device designed to dissipate heat away from objects or surfaces in order to prevent them from becoming too hot due to the thermal energy. The device features a low profile design, a black anodized top fin, and an electroplated bottom fin for corrosion resistance and a smooth finish. The ATS-08B-170-C2-R0 also features a thermal pad that helps transfer heat away from the object or surface, an extruded aluminum heat sink with fins that help to increase the surface area of the device, and a unique airflow design that helps to enhance the thermal performance. The ATS-08B-170-C2-R0 is suitable for a variety of electronics applications, such as LED lights, appliances, and high-power electronics.
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