
Allicdata Part #: | ATS14039-ND |
Manufacturer Part#: |
ATS-08B-193-C2-R0 |
Price: | $ 3.47 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X6MM XCUT T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.15000 |
10 +: | $ 3.06684 |
25 +: | $ 2.98418 |
50 +: | $ 2.81849 |
100 +: | $ 2.65268 |
250 +: | $ 2.48686 |
500 +: | $ 2.40397 |
1000 +: | $ 2.15528 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.236" (6.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 21.10°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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ATS-08B-193-C2-R0 is a thermal-heat sink device designed for power management in certain applications. It is mainly characterized by its small size, good thermal performance, and adjustable speed. The device is also reliable and efficient with regard to cooling.
Thermal-heat sinks are devices that transfer the heat energy produced by electronic components to other devices in order to reduce their operating temperatures. Heat transfer is one of the most commonly used methods of heat management in electronic applications. Heat sinks are commonly used to cool computers, servers, and other energy-devices.
The ATS-08B-193-C2-R0 is a two-piece design, consisting of a fan and a heat sink. The fan is made from a blend of copper and aluminum, which provides excellent heat transfer capabilities along with a low weight. The fan is adjustable in speed settings, allowing for effective cooling even when components are overheating.
The heat sink is a flat aluminum plate with a variety of fins for heat dissipation. These fins provide a great surface area for heat to be dissipated into the atmosphere, lowering the operating temperature of the components. The flat surface also allows the fan to draw additional air through the device.
The ATS-08B-193-C2-R0 is mainly used in applications where heat management is critical. It is ideal for circuit boards, electrical systems, and other devices which need to be kept cool. The device’s size and weight also make it ideal for low-profile designs.
The ATS-08B-193-C2-R0 is an excellent choice for thermal-heat sink devices. Its small size, good thermal performance, and adjustable speed make it an ideal choice for many applications. The device is also reliable and efficient with regard to cooling, making it a great choice for power management in applications where heat management is critical.
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