ATS-08B-199-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS14045-ND

Manufacturer Part#:

ATS-08B-199-C2-R0

Price: $ 3.88
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X6MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08B-199-C2-R0 datasheetATS-08B-199-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.52170
10 +: $ 3.42405
25 +: $ 3.23366
50 +: $ 3.04340
100 +: $ 2.85314
250 +: $ 2.66293
500 +: $ 2.47272
1000 +: $ 2.42517
Stock 1000Can Ship Immediately
$ 3.88
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.236" (6.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.83°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are an essential component of any electronic device or system; they transfer the heat generated by any electronic components away from the component and provide passive cooling to the system, thus preventing potential damages caused by overheating. ATS-08B-199-C2-R0 is a type of Thermal Heat Sink, and the following will discuss its application field and working principle.

ATS-08B-199-C2-R0, developed by International Components Corporation, is a type of Thermal Heat Sink specifically designed for use with high-power integrated circuits. The device has a high heat transfer rate of 330W/m2 and is able to quickly dissipate heat away from the circuit, thus preventing overheating. The heat sink is also constructed with an aluminum-zinc base and a black anodized finish to ensure corrosion-resistance. Additionally, the device features a two-layer design, with grooves on the upper layer, allowing for more efficient heat dissipation.

ATS-08B-199-C2-R0 is suitable for use in any high-power system, including applications such as motor control, inverters, and switching power supplies. Additionally, its high heat transfer rates allow for increased operating temperatures and reduces system cycle time. ATS-08B-199-C2-R0 is also able to improve system reliability and longevity, thus ensuring the system runs smoothly even when exposed to excessive heat.

In terms of its working principle, the device relies on the principle of conduction. Through the use of grooves in the upper layer of the heat sink, air is drawn in along the surface of the device, dissipating the heat generated by the circuit. This helps to lower the temperature of the system, preventing overheating. The aluminum-zinc base further helps to dissipate the heat, drawing it away from the center of the system.

In conclusion, ATS-08B-199-C2-R0 is a Thermal Heat Sink that is designed for use in high-power systems. It features a two-layer design, with grooves on the upper layer for increased heat dissipation, and an aluminum-zinc base to ensure corrosion-resistance. It is suitable for use in applications such as motor control, inverters, and switching power supplies, and is able to quickly dissipate the heat generated by the circuit. Its working principle is based on the principle of conduction, with grooves in the upper layer drawing air in along the surface of the device to dissipate the system’s heat, and the aluminum-zinc base drawing it away from the center of the system.

The specific data is subject to PDF, and the above content is for reference

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