ATS-08B-45-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08B-45-C1-R0-ND

Manufacturer Part#:

ATS-08B-45-C1-R0

Price: $ 3.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08B-45-C1-R0 datasheetATS-08B-45-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.92446
30 +: $ 2.84550
50 +: $ 2.68733
100 +: $ 2.52926
250 +: $ 2.37119
500 +: $ 2.29216
1000 +: $ 2.05503
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.95°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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The ATS-08B-45-C1-R0 is an example of a type of engineering hardware known as a thermal-heat sink. In essence, it is a physical component built to dissipate heat generated from electrical equipment, thus helping to maintain the safe and stable operation of the unit. Through the use of various engineering principles, the ATS-08B-45-C1-R0 is made to transfer this heat away from its source, preventing damage and possible malfunctioning of the unit.

The ATS-08B-45-C1-R0 operates by way of passing heat away from the object it is designed to protect. This is done through a process known as conduction, whereby heat is absorbed via a material with a high electrical conductivity, such as an aluminum alloy, and then transferred to an area with a lower temperature.

When the ATS-08B-45-C1-R0 is employed in an engineering setup, the thermal-heat sink is typically connected to a nearby metal frame. This serves as a heat conduit, whereby the thermal-heat sink absorbs the heat generated from the device it is shielding. As the heat is transferred from the device, the thermal-heat sink separates it from the rest of the device, dissipating it into the environment instead.

To ensure efficient absorption and dispersal of heat, the ATS-08B-45-C1-R0 is typically accompanied by other components such as thermally insulated tubing, fans, and baffles. If necessary, additional materials, usually in the form of conducting substances, may also be employed to increase the capacity of the thermal-heat sink to absorb and disperse heat.

The application of the ATS-08B-45-C1-R0 is far reaching, as the broad range of devices potentially capable of generating excessive amounts of heat are seemingly innumerable. Such devices range from basic electronic appliances and equipment to complex, mission-critical machinery and systems used in the automotive, aerospace, scientfic, medical, and military industries. Regardless of the application, the thermal-heat sink is the ideal engineering tool for protecting such devices from the dangers of excessive heat.

Information technology equipment and components are another application field of the ATS-08B-45-C1-R0 thermal-heat sink. In these cases, the thermal-heat sink comes into play when the computer’s processor and other core components generate far greater amounts of heat than can otherwise be dissipated via natural air convection. By absorbing and dispersing this excess heat, the ATS-08B-45-C1-R0 helps to ensure the stable and safe operation of a wide range of IT applications, from individual personal computers to large scale server systems.

In summary, the ATS-08B-45-C1-R0 is a specialized thermal-heat sink engineered to efficiently absorb and disperse excessive amounts of heat generated by a variety of devices and components. Utilizing the principles of conduction, this engineering tool is able to transfer this heat away from its original source, while protecting it from the damage or malfunctioning caused by the buildup of excessive heat levels. As a result, it is widely employed in fields such as information technology, automotive, aerospace, medical, and military, where the presence of undesired heat can lead to the potential breakdown of a device based on its delicate structure and components.

The specific data is subject to PDF, and the above content is for reference

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