| Allicdata Part #: | ATS-08B-55-C3-R0-ND |
| Manufacturer Part#: |
ATS-08B-55-C3-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08B-55-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28419 |
| 30 +: | $ 3.19557 |
| 50 +: | $ 3.01795 |
| 100 +: | $ 2.84042 |
| 250 +: | $ 2.66291 |
| 500 +: | $ 2.57415 |
| 1000 +: | $ 2.30786 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-08B-55-C3-R0 is one of the most popular thermal-heat sink solutions currently on the market. It is primarily used in applications such as consumer electronics, automotive electronics, medical devices, instrumentation, avionics and more. It is designed to provide efficient cooling performance, while minimizing the size of the device. In this article, we will look at the application field and working principle of the ATS-08B-55-C3-R0.
The ATS-08B-55-C3-R0 is a passive thermal-heat sink designed to dissipate heat away from electronic components. It works by transferring heat from the hot component to the heat sink which is then dissipated away from the component and into the surrounding air. The heat sink consists of a central block of aluminum material which provides a flat surface for the component to rest on. The block is surrounded by a finned structure which allows heat to be transferred away from the component much faster and more efficiently.
The application field of the ATS-08B-55-C3-R0 is vast and includes a range of different applications. It is highly resistant to a variety of temperatures, making it suitable for a range of industries including automotive, instrumentation and aerospace. The ATS-08B-55-C3-R0 is also used in medical devices, computers and other consumer electronics. It is also used in high power applications such as power supplies, telecommunications and server farms.
The working principle of the ATS-08B-55-C3-R0 is simple. It works by transferring heat away from the component and into the surrounding air. The heat is then dissipated into the atmosphere due to the presence of the fins which increase the surface area and allow for more efficient cooling. The fins also increase the air circulation which further improves the efficiency of the cooling process. The ATS-08B-55-C3-R0 is designed to be mounted on a board or other surface and placed in close proximity to the heat-producing components to ensure maximum cooling performance.
In conclusion, the ATS-08B-55-C3-R0 is an excellent thermal-heat sink solution which can be applied to a range of different applications. It is designed to transfer away heat efficiently and quickly, while taking up minimal space. It can be used in a variety of industries including automotive, medical devices, instrumentation and high power applications. Its working principle is simple and efficient, making it an ideal choice for anyone looking for a reliable and effective thermal-heat sink solution.
The specific data is subject to PDF, and the above content is for reference