| Allicdata Part #: | ATS14088-ND |
| Manufacturer Part#: |
ATS-08B-63-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08B-63-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions are becoming increasingly important with the ongoing development of digital technologies. Heat dissipation, in particular, is a major factor in maintaining the performance and durability of electronic components. The ATS-08B-63-C2-R0 is a solution designed to facilitate efficient thermal management by providing efficient heat transfer through aluminum construction and an innovative design.
The ATS-08B-63-C2-R0 helps to dissipate thermal energy from electrical components in a variety of applications. The product is classified as a heat sink, which is a type of heat dispersal device or system designed to regulate the temperatures of components by dissipating heat away from them. Heat sinks work by transferring heat from a hot area to a cold area through conduction, convection, and/or radiation. In the case of the ATS-08B-63-C2-R0, the heat is transferred through an aluminum construction that dissipates the heat away from the components efficiently. The design of the product also incorporates an integrated fan, which helps to further enhance the heat dissipation process.
The ATS-08B-63-C2-R0 is ideal for use in computers, video game consoles, and other electronic components and systems that generate a significant amount of heat. It can be used in a variety of applications, such as circuit board assemblies, system board assemblies, power supplies, and more. The product’s heat dissipating capabilities can be enhanced with the use of additional cooling components, such as fans and air conditioners, and by mounting the device to a metal surface to maximize thermal transfer.
The ATS-08B-63-C2-R0 is designed to be highly efficient, durable, and reliable. Its aluminum construction ensures maximum heat transfer between the source and the surrounding air, and the product also includes a heat-resistant flat surface for mounting components. The product also features a locking mechanism that secures the heat sink to the board to prevent it from coming loose over time. Additionally, the product is compliant with the RoHS standard, which helps ensure that it is optimized to perform in a safe and efficient manner.
Overall, the ATS-08B-63-C2-R0 is an excellent solution for devices and systems with significant heat output. Its innovative design and aluminum construction provides superior thermal transfer, and its efficient operation helps to prevent overheating and ensure maximum component performance and longevity. Therefore, the ATS-08B-63-C2-R0 is a great choice for applications that require effective thermal management for optimal device performance.
The specific data is subject to PDF, and the above content is for reference