ATS-08B-67-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.30°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are an important component of most electronic devices. They are designed to dissipate heat energy away from sensitive components, such as processors and memory chips. The ATS-08B-67-C2-R0 is a unique type of thermal - heat sink, designed to perform better than traditional aluminum or copper sinks. This article will discuss the application field and working principle of this product.

ATS-08B-67-C2-R0 Application Field

The ATS-08B-67-C2-R0 is ideally suited for applications such as:

• Computer hard drives
• DVD recorders
• Mobile devices
• Audio players
• Laser printers
• High-powered servers
• Industrial PCs

In addition to these areas, the ATS-08B-67-C2-R0 is also suitable for applications where its unique features can be leveraged for superior cooling performance. It is particularly well suited for applications where frequent access to the inner components of a system is required.

ATS-08B-67-C2-R0 Working Principle

Unlike traditional aluminum or copper heat sinks, the ATS-08B-67-C2-R0 utilizes a unique technology known as "Thermally Conductive Ceramics". This technology enables the ATS-08B-67-C2-R0 to achieve higher cooling efficiency by reducing the distance that heat needs to travel from the source before it is dissipated into the atmosphere. The ATS-08B-67-C2-R0 is composed of two layers: a ceramic layer which conducts the heat energy, and a metal layer which dissipates the heat energy. The ceramic layer is coated with a special thermal adhesive, which helps to ensure good thermal contact between the two layers. This thermal adhesive is nonconductive, allowing for increased efficiency and improved thermal profiles.

Conclusion

The ATS-08B-67-C2-R0 is an ideal thermal-heat sink for a range of applications, including high-powered servers, industrial PCs, and mobile devices. Its unique design utilizing thermally conductive ceramics ensures higher cooling efficiency and improved thermal profiles. Whether your application requires superior cooling performance or you just need a reliable solution that can handle the extreme temperatures generated by modern CPUs, the ATS-08B-67-C2-R0 can be an invaluable asset to your overall cooling setup.

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