Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	23.94°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-08B-85-C1-R0 Application Field and Working Principle

Heat sinks are a type of mechanical device used to dissipate and transfer heat from other components. Thermal management is an essential factor for the reliability and longevity of many electronic components. Heat sinks become increasingly important in many different industries, most notably in computers and other electronic components. The aim of this article is to explain the lifespan of a particular type of device, the ATS-08B-85-C1-R0, used in computer and other electronic circuits. It will cover both the application field and the working principle of the device.The ATS-08B-85-C1-R0 heat sink is a type of metal structure, such as aluminum or copper, which is used to conduct and dissipate the heat generated by other components. This type of device is designed to improve the thermal performance of computers and other electronic circuits by allowing heat to escape from the system quickly. It can be used to dissipate heat from high-power components such as CPUs, GPUs, power supplies, and RAM. It is also widely used in other industries that require thermal management, such as telecommunications, automotive, aerospace, and medical device manufacturing.The ATS-08B-85-C1-R0 has a design that allows it to absorb and transfer the heat from components to the surrounding environment. It is made up of a combination of small fins, or surface areas, along with a large heatsink base. When heat is generated by components, these fins draw in the heat and transfer it to the large heatsink base, which dissipates the heat into the atmosphere. This heat dissipation allows for improved thermal performance of the entire system. The device can be mounted in a variety of locations, depending upon the application, to best optimize the transfer of heat from the component to the heatsink.In addition to dissipating heat from components, the ATS-08B-85-C1-R0 can also be used to create a vacuum in the system. This is done by forcing air into the gap between the heatsink and the board, causing a vacuum. This vacuum can be used to reduce the risk of overheating of components. It also helps to minimize the impact of shock waves on the system, thereby reducing failure of components.The ATS-08B-85-C1-R0 is a highly reliable product, which provides a long lifespan and is especially suited for use in harsh and high-temperature environments. It is a cost-effective solution for reducing the risk of overheating and component failure. The device can be easily mounted and adjusted to optimize heat dissipation and maximize thermal performance. It is a preferred product for many applications, such as computer and other electronic circuits, telecommunications, automotive, aerospace, and medical device manufacturing.Heat sinks are an important part of any computer system and are an essential component in providing thermal management. The ATS-08B-85-C1-R0 is an ideal solution for dissipating heat from components and creating a vacuum in the system. It is reliable, durable, cost-effective, and can be easily adjusted to optimize the thermal performance of the system. With its wide range of application fields, it is a popular product for many industries.

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