ATS-08C-01-C3-R0

Thermal - Heat Sinks are an important part of the cooling system as they play a crucial role in dissipating heat from electronics to maintain its steady performance and prolong its lifespan. The ATS-08C-01-C3-R0 is a thermal-heat sink designed to meet the needs of high-end electronics, such as CPUs, GPUs, CPUs, peripherals, and FPGAs. It is the perfect choice for applications that require high-quality cooling solutions with a compact form factor.

The ATS-08C-01-C3-R0 is composed of an aluminum extrusion with a beveled edge profile and a top layer of die-cast aluminum alloy. The design has a thermal conductivity of 3.5 W/mK. The top layer of die-cast aluminum alloy dissipates the heat more efficiently than traditional copper heat sinks, while the bottom layer of aluminum extrusion helps dissipate any residual heat. This design also enables improved airflow, reduced noise, and improved system stability.

The ATS-08C-01-C3-R0 features an integrated cooler plate that ensures efficient thermal management with an optimized thermal conductivity of 3.5 W/mK. This allows the heat sink to handle high-performance processors and other sensitive components with extra cooling efficiency. Additionally, the combination of the aluminum extrusion and die-cast aluminum alloy provides excellent structural stability for the heat sink and longer operational life.

The ATS-08C-01-C3-R0 is designed to fit common components such as AMD and Intel CPUs, GPUs, FPGAs, peripheral connectors, and small drives. It is also compatible with a variety of cooling solutions, such as fanless or passive cooling, and can be easily installed and removed. This heat sink is available in a variety of standard and custom sizes, making it easy to install into tight spaces or with difficult access points. It is also suitable for many different applications, such as mini PCs, server solutions, and consumer electronic solutions.

The ATS-08C-01-C3-R0 thermal-heat sink is an ideal solution for cooling high-performance electronics without the need for additional fans or other bulky cooling solutions. The beveled edge profile and die-cast aluminum alloy combine to provide superior thermal management, allowing for increased components stability even in environments with extreme temperature fluctuations. The integrated cooler plate ensures maximum cooling efficiency while the aluminum extrusion adds an extra layer of insulation. With its compact form factor, integrated cooler plate, and superior thermal management, the ATS-08C-01-C3-R0 offers excellent performance and value, making it the perfect choice for any thermal-heat sink application.