| Allicdata Part #: | ATS-08C-05-C1-R0-ND |
| Manufacturer Part#: |
ATS-08C-05-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-05-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in the protection and efficiency of a wide variety of electronic components. The ATS-08C-05-C1-R0 is a high performance heat sink designed to efficiently dissipate heat generated by electronic components in high-temperature applications. This heat sink offers superior performance compared to air-cooled solutions, making it ideal for a variety of thermal management applications.
Heat Sink Structure
The ATS-08C-05-C1-R0 is a rectangular aluminum extrusion with threaded side walls to provide quick and easy mounting in its application. The core of the device is composed of a two-tubular fin structure to maximize the surface area exposed to the air. The fin structure is embedded with numerous air gaps to ensure airflow is maximized. The fins are surrounded by a corundum finish to provide enhanced mechanical strength and improved heat conductivity.
Application Field
The ATS-08C-05-C1-R0 is well suited for a variety of applications. It can be used in high-temperature electronics such as in protection relays, sensors, and motors. It also works well as a heat dissipater in extruders, 3D printers, and more. It is also a great choice for use in LEDs, as the corundum finish of the heat sink helps to disperse the heat more evenly.
Working Principle
The ATS-08C-05-C1-R0 works on the principle of thermal conduction. When heat is generated in an electronic component, it is transmitted to the heat sink via conduction. The heat sink then dissipates the heat into the surrounding air, where it is taken away by natural convection or forced convection. The ATS-08C-05-C1-R0 is designed to maximize the surface area exposed to the air, which helps it to efficiently dissipate the heat generated in the component.
Conclusion
In summary, the ATS-08C-05-C1-R0 is a high-performance heat sink ideally suited for a variety of thermal management applications. It is constructed to offer superior performance compared to air-cooled solutions, making it an excellent choice for electronic components in high-temperature applications. Its core is composed of a two-tubular fin structure embedded with numerous air gaps to ensure optimal Heat and air flow. This allows it to efficiently dissipate the heat generated in the component, without overheating or degrading its performance.
The specific data is subject to PDF, and the above content is for reference