ATS-08C-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08C-10-C1-R0-ND

Manufacturer Part#:

ATS-08C-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08C-10-C1-R0 datasheetATS-08C-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are a crucial component for modern devices, computers, and other electronic devices, as thermal energy can easily degrade any electronic component if not appropriately managed. ATS-08C-10-C1-R0 is a popular thermal management system that offers a wide range of applications and features for commercial, industrial, and consumer applications.

The ATS-08C-10-C1-R0 has many features that make it ideal for thermal management solutions. This comprehensive device includes a wide array of input options in the form of either dielectric or DC signal. Additionally, the ATS-08C-10-C1-R0 has excellent temperature sensing, control, and output signal accuracy due to its integrated temperature probe and thermocouple connected to the temperature sensing circuit. In addition, ATS-08C-10-C1-R0 has overload protection for overcurrent and voltage, as well as adjustable temperature and power settings.

The ATS-08C-10-C1-R0 is a thermal-regulated heat sink that utilizes thermal management principles and works on two basic principles. First, the intake air temperature is sensed by the temperature probe, and then sent to the temperature sensing circuit. The temperature sensing circuit then modulates the temperature of the heatsink by controlling the on/off switching of the control circuitry.

The second principle is designed to reduce the amount of thermal energy generated by the heat sink. This is done by using a “pulse offset modulation” technique. This technique uses a current pulse, coupled with a voltage regulator to reduce the heat dissipated by the heat sink. The current pulse is generated at the heatsink’s panel, and then is adjusted to best match the device’s power needs. By doing this, the device can run in a much cooler environment.

Once the temperature sensing and position the adjustment is complete, the ATS-08C-10-C1-R0 can provide a wide range of applications and features. Some applications and features include cooling LED devices, reducing dust accumulation, improving signal integrity, reducing heat losses, cooling and controlling temperature of peripheral devices, and thermal solutions for processor and chipset cooling.

Perhaps the most important application of the ATS-08C-10-C1-R0 is to provide a consistent and efficient cooling solution for all types of electronic devices. Its thermal-regulated heatsink and integrated temperature sensing and pulse offset modulation technology ensure that the device maintains an optimal temperature. This EMI containment feature of the device ensures that the environment around the device is cleaner and more efficient, which is especially important for commercial and industrial applications.

The ATS-08C-10-C1-R0 thermal management solution is an important component of modern electronic systems. Its versatile design and comprehensive features make it ideal for many applications, including those involving LED devices, dust accumulation, signal integrity, heat losses, cooling and thermal solutions for processor and chipset cooling. The device is easy to install and configure and its pulse offset modulation and thermally adjustable settings makes it ideal for any electronic device.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics