ATS-08C-10-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.99°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are an essential component in many electronic systems, providing thermal management by transferring heat away from sensitive circuitry. The ATS-08C-10-C3-R0 is a type of heat sink typically used in applications such as industrial or medical fields, where it is important to maintain a consistent low temperature to keep delicate equipment or components functioning properly. The ATS-08C-10-C3-R0 is a versatile device that is designed to perform multiple functions depending on the specific application.

Application Field

The ATS-08C-10-C3-R0 is suitable for applications in a variety of industrial, medical, or research settings. It is typically used where temperatures need to remain consistent and low. The ATS-08C-10-C3-R0 is suitable for use in applications such as laser and medical imaging equipment, electronic test and measurement equipment, and data storage and process control systems. The ATS-08C-10-C3-R0 is also suitable for use in defense systems, such as missile guidance systems, where the need for consistent temperature regulation of critical components is essential.

Working Principle

The ATS-08C-10-C3-R0 operates on a principle of convection cooling. This involves the transfer of heat away from the delicate components by an airflow of cooler air across the device. It is designed to dissipate heat from a hot surface, such as the electronics components it protects, by transferring the heat through a metal body or fin back to the ambient air.The ATS-08C-10-C3-R0 is constructed with an array of evenly spaced conductive metal fins that are designed to efficiently transfer the heat away from the component to be cooled. As the air passes over the fins, the heat is dissipated and cool air is drawn in, keeping the temperature of the surrounding environment consistent. This also keeps temperature sensitive parts, such as delicate circuit boards, functioning correctly and prevents damage from overheating.The ATS-08C-10-C3-R0 also has a number of features that make it unique. Its three-dimensional construction helps to ensure an even spread of heat on the surface of the component to be cooled. It also has a number of options available for customizing the construction of the heat sinks to specific application needs. Additionally, the ATS-08C10-C3-R0 has an included thermal performance monitoring feature. This ensures that the device is following the necessary regulations to deliver the required cooling power.

Conclusion

In conclusion, the ATS-08C-10-C3-R0 is a versatile type of heat sink with many applications in industrial, medical, and research settings. It operates on a principle of convection cooling and is designed to dissipate heat from a hot surface through a metal body and fins back to the ambient air. Additionally, the ATS-08C-10-C3-R0 has features such as its three-dimensional construction, customizable construction options, and a thermal performance monitoring feature. These features make it an ideal device for controlling the temperature of components in any environment.

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