| Allicdata Part #: | ATS-08C-100-C1-R0-ND |
| Manufacturer Part#: |
ATS-08C-100-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-100-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are electronic components used to dissipate thermal energy from integrated circuits and other electronic components. Heat sinks are an important component of any device and are a key component in developing an effective thermal management strategy. This article will discuss the application field and working principle of the ATS-08C-100-C1-R0 heat sink.
Application Field of ATS-08C-100-C1-R0 Heat Sink
The ATS-08C-100-C1-R0 heat sink is designed for use with various electronic components including microprocessors, transistors, diodes, voltage regulators, chipsets, and power amplifiers. The ATS-08C-100-C1-R0 heat sink can be used in a wide range of applications including industrial, medical, and consumer electronics. The ATS-08C-100-C1-R0 heat sink is made of aluminum alloy and is designed for high efficiency cooling. The heat sink has a thickness of 8.0mm and a large heatsink surface area that increases its capacity for heat dissipation. The ATS-08C-100-C1-R0 heat sink is suitable for operating temperatures between -30°C and +125°C.
Working Principle of ATS-08C-100-C1-R0 Heat Sink
The ATS-08C-100-C1-R0 heat sink works on a simple principle - thermal energy is dissipated from the electronic components into the aluminum alloy of the heat sink. Heat is generated from the operation of electronics components, and when the heat sink is mounted directly to the component, the heat is transferred from the component to the aluminum alloy of the heat sink, where it is dissipated into the surrounding air. The heat sink has grooves that help the heat transfer, enabling faster cooling. The fins of the heat sink help increase the surface area to further dissipate the thermal energy. This increases the efficiency of the heat dissipation process and helps keep the temperature of the components at a safe level.
Conclusion
The ATS-08C-100-C1-R0 heat sink is a reliable and efficient heat dissipation solution for integrated circuits and other electronic components. It is designed to dissipate high amounts of heat quickly and efficiently and can be used in a wide range of applications and operating temperatures. Its grooved design and large heat sink surface area help accelerate the process of dissipating heat away from the components and keep them running cool.
The specific data is subject to PDF, and the above content is for reference