ATS-08C-100-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08C-100-C3-R0-ND

Manufacturer Part#:

ATS-08C-100-C3-R0

Price: $ 4.69
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08C-100-C3-R0 datasheetATS-08C-100-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.22163
30 +: $ 3.98727
50 +: $ 3.75278
100 +: $ 3.51823
250 +: $ 3.28369
500 +: $ 3.04914
1000 +: $ 2.99050
Stock 1000Can Ship Immediately
$ 4.69
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.79°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical factor in electronic and electrical systems. It is important to ensure proper temperatures for optimum performance and longevity of components and systems. ATS-08C-100-C3-R0 is a heat sink designed to dissipate the heat generated by an electronic component or system. The following article will explain the application field and working principle of ATS-08C-100-C3-R0 Thermal - Heat Sinks.

The ATS-08C-100-C3-R0 is an aluminum heat sink that is designed to dissipate heat generated by an electronic component or system. The heat sink is constructed of 0.08mm thick aluminum material, which has a very high thermal conductivity. It also has a finned design that increases the surface area, allowing the heat to be dissipated more quickly. The fins have high thermal displacement properties, making them very effective in dissipating heat. Additionally, the heat sink is fitted with seven mounting clips for easy installation and low-profile design.

ATS-08C-100-C3-R0 Thermal - Heat Sinks is designed for applications requiring cooling up to 100 Watts. As with any cooling system, the heat sink’s capacity is dependent on the ambient temperatures surrounding the component or system. The heat sink is capable of dissipating heat in operating temperatures between -30°C and 120°C. At higher operating temperatures the heat dissipated by the heat sink is decreased. The heat sink is suited most for applications that are under constant load, or for components that generate large amounts of heat during operation.

The ATS-08C-100-C3-R0 Thermal - Heat Sinks uses natural convection for the energy transfer from the heat source to the atmosphere. Natural convection is the process of thermal energy transfer from a hotter material to a colder one, or from a colder material to a hotter one. In this case, heat is transferred from the heat source to the atmosphere via natural convection. The heat sink is designed with an open finned design which increases the surface area and allows heat to be effectively dissipated more quickly.

The ATS-08C-100-C3-R0 Thermal - Heat Sinks is designed to be easy to install and use. The heat sink comes with seven mounting clips for an easy installation. It also has a low-profile design which helps to reduce the overall volume and weight of the heat sink. This allows the heat sink to fit in tight spaces where larger traditional heat sinks would not fit. The heat sink is also lightweight and can be easily installed with minimal hassle.

In conclusion, the ATS-08C-100-C3-R0 Thermal - Heat Sinks is an effective heat dissipating solution for electronic components and systems. The heat sink is constructed from 0.08mm thick aluminum material, with fins designed to increase the surface area and allow heat to be dissipated more quickly. The heat sink is capable of dissipating up to 100 Watts and has a low-profile design for easy installation. It is ideal for applications that require cooling or for components that generate large amounts of heat during operation. The heat sink is easy to install and use and offers an effective solution for thermal management.

The specific data is subject to PDF, and the above content is for reference

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