ATS-08C-104-C2-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	25.23°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are devices used to absorb and regulate heat in a system, typically in an electronics system such as a computer or a phone. The thermal requirements of these systems cannot be met by a single component or a simple cooling system, requiring the application of a heat sink. ATS-08C-104-C2-R1 is a heat sink designed for use in these types of systems.The ATS-08C-104-C2-R1 heat sink is an aluminum extruded, totally encapsulated and glass-filled heat sink containing both internal and external finned surfaces. This type of heat sink features superior surface area coverage, allowing for minimization of the thermal interface and an increased thermal conduction. Additionally, the heat sink’s stepped fin design and customized vertical ridging provide air cooling for larger heatsinks or components with a large area of air cooling contact.The internal fin design of the ATS-08C-104-C2-R1 heat sink is designed to provide superior surface area coverage, which helps increase the thermal conduction ratio by reflecting more of the heat away from the cool side. This also improves the air flow by allowing the air flow to follow the curved internal fins and increase cooling efficiency. Furthermore, the stepped fin design helps to reduce the thermal impedance and minimize the temperature variation across the heat sink.The unique vertical ridging on the ATS-08C-104-C2-R1 heat sink helps to increase the surface area contact with the cooling air. This helps improve air flow and thus cooling performance. Additionally, the glass-filled material provides enhanced strength and rigidity to the heat sink. This helps to reduce the amount of warpage on the component, which can cause undesirable thermal performance.The application of a thermal-heat sink like the ATS-08C-104-C2-R1 in an electronic system is essential for achieving adequate cooling performance. The heat sink’s internal fin design provides superior surface area coverage, while the vertical ridged design assists in dissipating heat in larger components or areas with greater air cooling contact. Furthermore, the glass-filled material helps to reduce warpage and ensure a consistent cooling performance. By using the ATS-08C-104-C2-R1 heat sink, users can rest assured that their electronic system will remain adequately cooled.

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