ATS-08C-110-C2-R1 Allicdata Electronics
Allicdata Part #:

ATS14146-ND

Manufacturer Part#:

ATS-08C-110-C2-R1

Price: $ 5.59
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X40X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08C-110-C2-R1 datasheetATS-08C-110-C2-R1 Datasheet/PDF
Quantity: 1000
1 +: $ 5.07780
10 +: $ 4.93920
25 +: $ 4.66452
50 +: $ 4.39022
100 +: $ 4.11585
250 +: $ 3.84146
500 +: $ 3.56707
1000 +: $ 3.49848
Stock 1000Can Ship Immediately
$ 5.59
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks play an important role in the safe and effective operation of electronic system components. In these systems, heat can quickly build up in densely packed areas, overloading the overall system and causing potentially catastrophic damage. Heat sinks help to maintain component temperatures within acceptable limits by dissipating excess heat to the environment. ATS-08C-110-C2-R1 is a type of heat sink used to remove heat from electronic system components. This article will explain the application field and working principle of the ATS-08C-110-C2-R1 heat sink.

The ATS-08C-110-C2-R1 is a thermal - heat sink designed for applications in a range of electronic products, from consumer goods to industrial automation systems. It is constructed with a finned aluminium base and heat pipes, which use pressurized liquid nitrogen to channel hot air away from components. It has an effective cooling capacity of 8We and is rated for operation temperatures up to 110°C. The ATS-08C-110-C2-R1 can be mounted on a variety of surfaces, such as walls, ceilings, and walls with brackets.

The working principle of the ATS-08C-110-C2-R1 heat sink is based on the heat pipe concept. The heat pipe works by using a pressurized, evaporative-cooling method to transfer heat away from hot components. A closed-loop system uses a heat pipe\'s heated liquid to carry the heat away from the component and into a heat dissipation mechanism, such as an aluminium base attached to the heat sink. As the heated liquid enters the base, it evaporates and transfers the heat away from the component and into the environment.

The ATS-08C-110-C2-R1 heat sink is reliable and efficient, making it a popular choice for a variety of electronic system applications. It is designed to maintain safe and optimal temperatures for electronic components, ensuring their long-term reliability. The heat pipe design also provides an efficient heat transfer mechanism, resulting in a significant reduction of heat buildup in the system. This makes the ATS-08C-110-C2-R1 heat sink a reliable and cost-effective cooling solution.

In conclusion, the ATS-08C-110-C2-R1 is a thermal - heat sink designed for cooling electronic systems in a range of applications. It works by using a closed-loop system to channel heat away from components and into a heat dissipation mechanism. This heat sink provides reliable and efficient cooling, ensuring the long-term reliability of system components. It is a cost-effective cooling solution that can be mounted on a variety of surfaces to provide optimal cooling performance.

The specific data is subject to PDF, and the above content is for reference

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