| Allicdata Part #: | ATS-08C-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-08C-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have become an important part of modern electronics systems, helping dissipate heat and protect sensitive electrical components from overheating and destruction. The ATS-08C-117-C1-R0 is a thermal - heat sink which has been designed to meet the requirements of high power and low cost applications.The ATS-08C-117-C1-R0 has a thermal resistance of 0.20C/W and is capable of dissipating up to 16W of heat. This makes it suitable for a wide range of applications. These include power converters, power amplifiers, motor controllers and high power electronic devices such as vacuum tubes, thyristors and transistors.The ATS-08C-117-C1-R0 has a copper base plate which acts as the heat spreader. Heat is collected from the device being cooled by the adjacent aluminum cold plates. The aluminum cold plates then conduct the heat to the copper base plate, which is further spread by a network of copper fins.The copper fins provide an increased surface area for heat dispersion and are specially designed to reduce air friction. The coefficient of thermalexpansion of the copper fins has been carefully matched to the coefficient of thermal expansion of the copper base plate for optimum performance.The ATS-08C-117-C1-R0 is designed to be mounted directly to an aluminum heat sink. The heat sink can be either a natural, forced or an active heat sink depending on the application requirements.The ATS-08C-117-C1-R0 is a cost effective and efficient thermal solution for a range of electronic applications. Its copper base plate is highly effective in dissipating heat and can be used in conjunction with a range of other commercial and industrial thermal solutions for greater performance.In summary, the ATS-08C-117-C1-R0 is an efficient and cost effective thermal - heat sink designed for use in a range of electronics applications. Its copper base plate and aluminum cold plates provide increased heat dispersion, while its copper fins reduce air friction for better thermal performance. This makes it suitable for use in power converters, power amplifiers, motor controllers and high power electronic devices.
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