ATS-08C-12-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

A thermal-heat sink is a device used to reduce operating temperatures of electronic components. It works by transferring heat away from the components to a cooler environment. As the demand for high power hardware increases, more reliable and efficient thermal-heat sinks are required. One of such heat sinks, the ATS-08C-12-C1-R0, is becoming increasingly popular due to its cost-effectiveness, efficiency, and higher power density compared to other thermal-heat sinks. This article will discuss the application field and working principle of the ATS-08C-12-C1-R0 thermal-heat sink.

Application Field

The ATS-08C-12-C1-R0 is suitable for a wide range of applications including server rooms, residential homes, office buildings, and industrial factories. Due to its special shape and slim profile, it can be easily installed in any space. It is also suitable for applications where clean environment, dust prevention, secure connection, and anti-vibration are required. Furthermore, its low noise output makes it an ideal choice for quiet environment.

Design Specifications

The ATS-08C-12-C1-R0 features a die cast aluminum design that keeps its weight comparatively low. Its single-fin construction ensures efficient heat dissipation and high thermal capacity. The built-in heat pipe provides long-term durability. It also features dc protection to protect the components from electrical damage. It also comes with optional accessories such as anti-vibration straps, fan guards, and mounting brackets for optionally further optimizing and securing installation.

Working Principle

The working principle of the ATS-08C-12-C1-R0 thermal-heat sink is straight forward. It works by dissipating the heat generated by electronic components. This is done by transferring the heat away from the component and passing it to the heat sink. This heat is then absorbed by the fins which act as a cooling surface. The resulting airflow dissipates this heat away from the component, providing a cooler environment for these components.

Conclusion

The ATS-08C-12-C1-R0 thermal-heat sink is a cost-effective, efficient, and reliable device to reduce operating temperatures of electronic components. It is suitable for a wide array of applications, and features slim profile and low weight. Its working principle is straight-forward; transferring heat away from the component to a cooler environment through the heat sink and cooling fins. It is easy to install and comes with optional accessories for further optimization.

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