Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-08C-127-C2-R0 is a thermal heat sink designed to dissipate heat generated by electrical components. Heat sinks are used in a variety of applications, from computer processors to automotive electronics. The ATS-08C-127-C2-R0 is a new generation of thermal heat sinks that is designed to maximize performance by using innovative design and construction technologies. In this article, we will discuss the application field and working principle of the ATS-08C-127-C2-R0 heat sink.

Application Field

Heat sinks are used in a variety of applications that involve the dissipation of heat. They are often used in computer processors, where they help to cool the processors by dissipating heat generated from its operation. They are also used in automotive electronics to cool electronic components, such as an ECU or ignition module. In addition, they can be used in industrial settings, such as in process control or LED lighting where they prevent components from overheating.

Working Principle

Heat sinks work on the principle of thermodynamics. Heat is generated by an electrical component, which then travels through the heat sink and into the surrounding environment via convection, conduction, and/or radiation. The ATS-08C-127-C2-R0 heat sink uses a combination of aluminum and copper elements to transfer heat from an electronic component to the environment.The heat sink comprises of a thermally conductive aluminum base plate for the component to be mounted on, a copper heat pipe to transport heat away from the component, and a finned aluminum profiling for dissipating the heat to the environment. The copper heat pipe is filled with a heat-conductive fluid, which then circulates over the component before dissipating it to the environment via the profiled aluminum fins.The ATS-08C-127-C2-R0 heat sink has a maximum operating temperature of 110 degrees Celsius. This ensures that the component is kept within safe temperature while providing efficient heat transfer between it and the environment.

Conclusion

In conclusion, the ATS-08C-127-C2-R0 is a thermal heat sink designed to dissipate heat from electrical components. It is used in a variety of applications, including computing and automotive electronics. The heat sink uses thermodynamics to transfer heat from the component to the environment via convection, conduction, and/or radiation and has a maximum operating temperature of 110 degrees Celsius.

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