| Allicdata Part #: | ATS14165-ND |
| Manufacturer Part#: |
ATS-08C-128-C2-R0 |
| Price: | $ 4.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-128-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.22100 |
| 10 +: | $ 4.10634 |
| 25 +: | $ 3.87803 |
| 50 +: | $ 3.64997 |
| 100 +: | $ 3.42184 |
| 250 +: | $ 3.19372 |
| 500 +: | $ 2.96560 |
| 1000 +: | $ 2.90857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for any type of technology to keep it running efficiently and effectively. Heat is produced in all types of electrical equipment and must be managed and controlled in order to maintain optimal system performance and reliability. Heat sinks are the most common and most effective way to manage and control heat, ensuring proper cooling and improved system reliability. The ATS-08C-128-C2-R0 Heat Sink is a highly advanced thermal management solution suitable for a wide range of applications.
The ATS-08C-128-C2-R0 Heat Sink is a finned aluminum heat sink specifically designed for use in power electronics and other high-power applications. It is constructed from extruded aluminum and features an anodized painted finish for increased corrosion resistance. The outer surface of the heat sink is designed to efficiently dissipate heat, providing an effective and reliable thermal management solution. The ATS-08C-128-C2-R0 Heat Sink offers superior thermal performance, enhanced durability, and increased reliability in even the most extreme conditions.
The ATS-08C-128-C2-R0 application field includes power supplies, power electronics, automotive components, medical electronics, telecom and networking equipment, as well as power amplifiers and transistors. It is designed to provide reliable and efficient thermal management for all types of integrated circuits. The heat sink is designed with patented high-efficiency fins and an optimized fin design, which helps to maximize heat dissipation and ensure consistent thermal performance.
The ATS-08C-128-C2-R0 works by dissipating heat into the atmosphere, rather than relying on cooling fans. This allows for higher efficiency in even the most extreme temperatures and helps to reduce device and system lifecycles. Heat is produced by the power components and dissipated by the fins into the air, providing a consistent and reliable thermal management solution. In addition, the heat sink is designed to maintain a steady temperature even when powered on for extended periods of time.
In addition to providing reliable thermal management, the ATS-08C-128-C2-R0 also offers cost savings through optimized thermal performance and lower maintenance costs. By reducing the temperature of the integrated circuits, the efficiency of the power components is improved, resulting in improved performance and system reliability. The heat sink also requires minimal maintenance and is highly reliable, providing years of reliable performance.
The ATS-08C-128-C2-R0 Heat Sink is an advanced thermal management solution designed for high-power applications. It is a highly reliable and efficient solution that helps to optimize the performance of power components and reduce system lifecycle costs. The heat sink is designed for a wide range of applications, and offers superior thermal performance and increased reliability in extreme environments. The optimized fin design and patented high-efficiency fins ensure consistent and reliable thermal performance, while the design of the fins helps to maximize heat dissipation.
The specific data is subject to PDF, and the above content is for reference