ATS-08C-131-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS14169-ND

Manufacturer Part#:

ATS-08C-131-C2-R0

Price: $ 5.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08C-131-C2-R0 datasheetATS-08C-131-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 5.05260
10 +: $ 4.91589
25 +: $ 4.64285
50 +: $ 4.36968
100 +: $ 4.09658
250 +: $ 3.82347
500 +: $ 3.55036
1000 +: $ 3.48209
Stock 1000Can Ship Immediately
$ 5.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-08C-131-C2-R0 is a Thermal - Heat Sinks. It is a heat exchange device that is used to draw heat away from a component in order to prevent damage to the device. This type of thermal management device is used in a variety of different industries including aerospace, telecommunications, computers, defense and medical.The ATS-08C-131-C2-R0 is a type of heat sink designed for cooling electronic components based on the process of heat conduction. It works by drawing away heat from hot components before the heat can be transferred to other parts of the system, thus preventing any thermal damage. This specific model is designed to work on a wide range of components, making it versatile and cost effective.The ATS-08C-131-C2-R0 has a number of features that makes it an attractive product. Its aluminum construction makes it light, durable and corrosion resistant. It also has a high thermal conductivity rate, making it an efficient heat sink. Additionally, it has a high tolerance for temperature fluctuations and an extended service life with minimal maintenance.The design of the ATS-08C-131-C2-R0 includes a number of features designed to make it a versatile and efficient heat sink. For example, it has a unique fin design which increases heat exchange efficiency and a U-Shape channel design that ensures maximum surface contact and optimal air circulation for heat to dissipate quickly. Additionally, the ATS-08C-131-C2-R0 has heat fins at the base of its design, providing a secure and reliable connection with the chassis.At the heart of the ATS-08C-131-C2-R0 is its working principle. By using the process of heat conduction, it is able to draw heat away from components, preventing them from becoming too hot. Heat is transferred into the heat sink fins by thermal radiation and then it is dissipated into the atmosphere by convection. This ensures that components remain at a safe temperature range and do not overheat or fail.The ATS-08C-131-C2-R0 is an extremely efficient heat sink and is used in a variety of different applications. It is suitable for cooling components such as CPUs, GPUs, memory modules, power modules and storage drives. It is also often used in industrial equipment that requires efficient cooling solutions such as 3D printers and CNC machines.The ATS-08C-131-C2-R0 is an efficient and cost effective thermal management device. With its unique fin design and U-Shape channel, it ensures maximum heat exchange efficiency and fast heat dissipation. Its aluminum construction makes it light and durable while its high thermal conductivity rate makes it an ideal choice for cooling components.

The specific data is subject to PDF, and the above content is for reference

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