| Allicdata Part #: | ATS-08C-147-C1-R0-ND |
| Manufacturer Part#: |
ATS-08C-147-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-147-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are becoming increasingly important in electronic circuits as voltage levels increase and power densities increase. Overheating can cause permanent damage to delicate and expensive electronic equipment. The ATS-08C-147-C1-R0 is a thermal heat sink that is designed to controll the temperature levels in a large variety of circuits and systems.
The ATS-08C-147-C1-R0 is an aluminum heat sink that is designed for use in a wide variety of applications such as computers, cell phones, and game consoles. It has a fin area of 97 CM2. Its total thermal resistance is 0.35 degree Celsius/Watt, with a thermal resistance of 0.25 degree Celsius/Watt at 25 degree Celsius. Its fanless design ensures whisper-quiet performance and long life.
The ATS-08C-147-C1-R0 is designed to reduce the operating temperatures of semiconductor components through direct heat conduction. Its tightly packed aluminum extrusion fins provide excellent heat transfer from the heatsink base to the ambient air. The fins also act as a buffer to spread out heat, which helps to reduce hot spots and ensure uniform cooling throughout the circuit.
The ATS-08C-147-C1-R0 is designed to be easily mounted to a variety of circuit boards and heat generating components. Its clip-on attachment system allows for easy installation and removal, while its extra-wide mounting screws provide secure attachment for reliable cooling performance. It also provides excellent electrical insulation for circuit board components.
The ATS-08C-147-C1-R0 utilizes the natural air flow in the environment to cool components. Its finned design allows air to flow in and out, dissipating heat as it passes through. The aluminum fins also absorb heat from the device, transferring it to the ambient air. This passive cooling technology ensures efficient cooling, even in low air flow scenarios.
The ATS-08C-147-C1-R0 is designed to provide reliable cooling performance while maintaining a low profile. Its special design allows for even distribution of heat from the device, ensuring uniform temperatures throughout. This prevents overheating, which can reduce the operating life of sensitive electronic components. Additionally, its advanced fanless design allows for whisper-quiet operation.
In summary, the ATS-08C-147-C1-R0 is a thermal heat sink designed for use in a wide variety of applications. It utilizes aluminum extrusion fins to dissipate heat, while its clip-on attachment system allows for easy installation and removal. It also provides excellent electrical insulation, and its fanless design ensures whisper-quiet performance and long life. This makes it an ideal solution for controlling temperatures in a variety of circuits and systems.
The specific data is subject to PDF, and the above content is for reference