| Allicdata Part #: | ATS-08C-168-C1-R0-ND |
| Manufacturer Part#: |
ATS-08C-168-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-168-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions provide essential cooling in many applications to keep essential components from over-heating and failing. Heat sinks specifically are necessary in applications with high-power components such as lasers, LEDs, and amplifiers to dissipate the heat created by those components by transferring the heat away from them to a cooler external surface. ATS-08C-168-C1-R0 is one type of heat sink designed to meet the specific needs of various electronic systems.
The ATS-08C-168-C1-R0 heat sink is designed to work in a variety of applications, but is particularly well-suited for applications with a high thermal load. It is designed with a large aluminum base and has a top surface area of only 8x168mm. The large size and efficient design of the ATS-08C-168-C1-R0 allow it to efficiently transfer heat away from components, keeping them cool and providing the necessary thermal management solution. The ATS-08C-168-C1-R0 has a total weight of only 2.3 grams, making it incredibly light and easy to install in tight spaces.
In addition to its small size and lightweight design, the ATS-08C-168-C1-R0 is designed for use in different applications. It has a dielectric strength of 2.18 GV/m, which makes it suitable for use in high-voltage applications. It is also designed with a high thermal conductivity of 0.50W/mK, allowing it to transfer heat away from a component quickly and efficiently. This is a critical aspect of thermal management that helps to prevent components from overheating and failing.
The ATS-08C-168-C1-R0 heat sink is also designed to be resistant to corrosion and environmental impacts. It is constructed from aluminum, which is a strong and durable material that is not easily damaged by water, salt, or other corrosive materials. In addition, the aluminum also provides excellent thermal conductivity, helping to more quickly and efficiently transfer heat away from components. This increases the overall performance of the heat sink, allowing it to better manage heat and reduce component failure.
The ATS-08C-168-C1-R0 heat sink is designed to efficiently transfer heat away from components and keep them from running too hot. The small size and lightweight design make it easy to install in tight spaces, while the corrosion resistance and durability make it suitable for use in different applications. The high conductivity allows it to work quickly and efficiently, making it an ideal choice for thermal management in systems with high-power components.
The specific data is subject to PDF, and the above content is for reference