| Allicdata Part #: | ATS14210-ND |
| Manufacturer Part#: |
ATS-08C-169-C2-R0 |
| Price: | $ 3.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-169-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.42090 |
| 10 +: | $ 3.32892 |
| 25 +: | $ 3.23870 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are one of the most important components of any electronic device that needs to dissipate heat. In many cases, the heat generated by the device must be efficiently managed in order to ensure its longevity and reliability. The ATS-08C-169-C2-R0 is a heat sink designed to help reduce the temperature of electronic devices while also providing a degree of thermal protection.The ATS-08C-169-C2-R0 is designed to dissipate heat from devices such as computer processors, graphics cards, transistor heat sinks, and other components that produce large amounts of heat. The heat sink utilizes a combination of natural convection and forced air circulation to cool components.When mounted to a component, the ATS-08C-169-C2-R0 uses a combination of aluminum alloy and thermally conductive materials to draw heat away from the device and into the heat sink. The heat sink utilizes a series of thermal fins which dissipates the heat energy into the air, reducing the total temperature of the device. Additionally, the mount is designed to allow for a direct connection to air cooling systems, such as fans or blowers.The ATS-08C-169-C2-R0 is designed to be space-efficient and flexible, allowing for use in a wide range of applications. It can be used on CPUs, GPUs, and other components that produce large amounts of heat. Additionally, the ATS-08C-169-C2-R0 is designed to be easily mounted onto other components, allowing for a secure and reliable connection.In addition to its thermally protective features, the ATS-08C-169-C2-R0 is also designed to reduce electrical noise and vibration. The heat sink utilizes a series of interior mounted dampers which absorb and dissipate vibrations from the device, helping to reduce electrical noise. This also makes the ATS-08C-169-C2-R0 suitable for use in a variety of industrial and medical applications as well.The ATS-08C-169-C2-R0 is designed to be highly reliable and durable. The heat sink is constructed from aluminum alloy, which is robust and corrosion-resistant. Additionally, the heat sink utilizes thermal paste to further enhance thermal conductivity and improve heat transfer efficiency.The ATS-08C-169-C2-R0 is an excellent choice for managing the temperature of electronic devices. Its combination of efficient thermal management, noise reduction and durability make it a great choice for a variety of applications.
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