| Allicdata Part #: | ATS14212-ND |
| Manufacturer Part#: |
ATS-08C-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of many electrical and electronic devices. The components must be properly cooled to ensure their safe and efficient operation. Heat sinks are a type of cooling device that are widely used for this purpose. The ATS-08C-170-C2-R0 is a high performance, easy-to-install, thermal solution that is designed to efficiently dissipate heat from high-power components.
The ATS-08C-170-C2-R0 is a two-piece, hybrid heat sink. It consists of an aluminum base with extruded aluminum fins, and a copper heat spreader. This combination of materials provides excellent thermal characteristics and efficient cooling. The copper heat spreader is optimized to efficiently transfer heat from the component to the fins, which then dissipates heat away from the component. The extruded aluminum fins feature a unique design that provides increased surface area. This results in improved dissipation of heat from the component.
The ATS-08C-170-C2-R0 is ideal for high power applications where efficient heat dissipation is critical. It is commonly used in power supplies, motor control systems, inverters, circuits boards, and other high power electronic devices. The hybrid heat sink can also be used in confined spaces where traditional finned heatsinks would be too bulky.
The ATS-08C-170-C2-R0 is designed for easy installation. The component can simply be clipped or screwed into the base of the heatsink. This ensures secure and reliable connection to the component, providing a secure connection between the component and the heatsink. Additionally, the base of the heatsink is designed to ensure proper alignment when mounting to ensure maximum transfer of heat to the fins.
To ensure the best performance, the amount of heat dissipation can be adjusted by changing the size and orientation of the fins on the ATS-08C-170-C2-R0. This provides the flexibility to select the best fan orientation in order to maximize cooling performance. Additionally, a thermal interface material can be used to optimize the thermal connection between the component and the heat spreader.
The ATS-08C-170-C2-R0 is an excellent solution for thermal management in high power electronic devices. It is designed for easy installation, is highly efficient, and can be customized to meet the particular application. The combination of its aluminum base and copper heat spreader provide excellent heat transfer, while the unique fin design ensures efficient dissipation of heat. This makes the ATS-08C-170-C2-R0 an ideal solution for thermal management in a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference