| Allicdata Part #: | ATS-08C-18-C1-R0-ND |
| Manufacturer Part#: |
ATS-08C-18-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-18-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential design element in today\'s electronic systems where components often require a large percentage of the board\'s energy to operate. Thermal - Heat Sinks are commonly used in order to dissipate this energy and prevent dangerous temperatures from occurring inside the device. The ATS-08C-18-C1-R0 is a thermal heat sink designed for a wide range of applications, and this article will discuss the features and working principles of this device in detail.
The ATS-08C-18-C1-R0 thermal heat sink is made from extruded aluminum and is designed for use in temperatures ranging from -40°C to +85°C. The contact area of the heat sink is increased by its diamond-shaped pattern, which allows for a larger surface area and more air circulation. The ATS-08C-18-C1-R0 also features an integrated fan mount and adjustable mounting brackets, making it easy to install and adjust for the desired device orientation. The design of the heat sink helps to ensure maximum performance even at high temperatures.
The ATS-08C-18-C1-R0 thermal heat sink is designed to be used in a variety of applications where a reliable, efficient, and cost-effective thermal solution is required. Such applications may include industrial equipment, transportation systems, medical equipment, LED lighting, and telecommunications systems. The heat sink can also be used in laboratory and scientific instrumentation applications where optimal thermal performance is important.
In addition to its broad range of application fields, the ATS-08C-18-C1-R0 thermal heat sink also has several advantages that make it an ideal choice. For example, it features low thermal resistance, which means that more energy can be dissipated while allowing the component to run cooler. In addition, the heat sink is extremely easy to install and has adjustable features which allow it to be adapted for a variety of applications. Furthermore, the heat sink is manufactured using high-grade extruded aluminum, making it both lightweight and corrosion-resistant.
The ATS-08C-18-C1-R0 thermal heat sink utilizes extruded air convection to dissipate energy away from the component. This uses the ambient air to draw heat away from the component and carry it away, allowing a decrease in the component\'s operating temperature. The heat sink\'s aluminum construction also helps to reflect waste heat, further reducing the temperature of the component. This combination of air convection and thermal reflection helps the ATS-08C-18-C1-R0 to provide a reliable and efficient thermal solution for a wide range of applications.
In conclusion, the ATS-08C-18-C1-R0 thermal heat sink is a reliable and efficient thermal solution for a broad range of applications and environments. The adjustable features and lightweight aluminum construction make it easy to install and maintain, while its high-performance thermal characteristics help to ensure maximum cooling efficiency for various components. The ATS-08C-18-C1-R0’s combination of air convection and thermal reflection provides an economical and reliable solution for a wide range of applications, making it an ideal choice for many designers and engineers.
The specific data is subject to PDF, and the above content is for reference