ATS-08C-197-C3-R0

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Heat sinks are integral components used in the electrical engineering and cooling sectors where heat absorption from diverse electronic components needs to be efficiently managed. The ATS-08C-197-C3-R0 heat sink is a versatile and reliable solution to this common problem. As a component of a cooling system or as a standalone heat dissipation device, the ATS-08C-197-C3-R0 thermal heat sink can provide superior performance for a range of applications.

The ATS-08C-197-C3-R0 is a compact, single-piece heat sink designed to provide effective heat rejection with minimum volume and weight. The unit features a deep ridged fin stack to ensure maximum heat dissipation through natural and forced convection on both sides of the fin stack. The unit is soldered into circuit boards or bolted onto application substrates, which makes it an ideal and reliable choice for compact applications.

The ATS-08C-197-C3-R0 comprises a solid aluminum fin strip with a thermal conductivity of 215 W/mK, ensuring excellent performance and reliability. The design also provides excellent surface contact for high thermal transfer rates on both sides. The fins of the heat sink are further reinforced with a solderable aluminum bonding tape, which increases the overall strength and stability of the unit.

The ATS-08C-197-C3-R0 is designed for a wide range of operating temperatures, ranging from -40°C to + 85°C. The unit can achieve operating temperatures as low as -40°C, while still maintaining high performance. The unit also features a range of additional features, such as superior corrosion resistance and anti-rotation features.

The ATS-08C-197-C3-R0 works by dissipating thermal energy through natural and forced convection on both sides of the fin stack. The deep ridges of the fin stack maximize heat transfer by increasing the surface area of the heat sink, allowing for greater air movement and better heat dissipation. The unit also features high-performance aluminum bonding tape, which ensures solid contact with the circuit boards or substrate, leading to superior thermal performance.

In addition to its excellent thermal performance, the ATS-08C-197-C3-R0 heat sink is also designed for long-term use in a wide range of operating environments. With its wide operating temperature range, anti-rotation features, and superior corrosion resistance, the unit provides reliable performance and stability for many years of use. Furthermore, the unit can be quickly and easily soldered onto circuit boards or bolts to substrates for additional convenience and flexibility.

The ATS-08C-197-C3-R0 thermal heat sink is an ideal choice for a range of applications, from cooling computer components to managing the thermal energy of larger electronics. With its compact design, superior performance, and excellent long-term reliability, the ATS-08C-197-C3-R0 is an ideal heat sink solution for those needing reliable thermal management.

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