| Allicdata Part #: | ATS-08C-207-C3-R0-ND |
| Manufacturer Part#: |
ATS-08C-207-C3-R0 |
| Price: | $ 4.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-207-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.21029 |
| 30 +: | $ 3.97635 |
| 50 +: | $ 3.74245 |
| 100 +: | $ 3.50860 |
| 250 +: | $ 3.27469 |
| 500 +: | $ 3.04079 |
| 1000 +: | $ 2.98231 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.47°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
.Thermal management is an essential element of most electronic systems today, and the ATS-08C-207-C3-R0 is among the most popular thermal-heat sinks available on the market. It is a thermal transfer device designed to dissipate the heat generated by electronic components, such as transistors, resistors, and diodes, that are employed in various types of application fields. This product is made of aluminum, is highly efficient, and has low thermal resistance. It also has a low profile design, making it suitable for use in a variety of applications.
ATS-08C-207-C3-R0 Application Fields
The ATS-08C-207-C3-R0 can be used in a variety of application fields. This includes semiconductor systems, electronic display systems, medical equipment, networking and communication systems, automobiles and other transportation equipment, industrial equipment, and computer systems. It can also be used for cooling processors, transistors, and other components found in various types of electronic and industrial equipment.
ATS-08C-207-C3-R0 Working Principle
The ATS-08C-207-C3-R0 uses thermal transfer principles to dissipate heat. This is accomplished by absorbing and diffusing heat away from the source and dispersing it in the surrounding air. The device absorbs heat from the component’s surface and transfers it away to the heat sink. This alone reduces the temperature of the component, allowing it to remain cooler and operate more efficiently. The heat sink also diffuses away the heat and moves it into the surrounding air, thus further reducing its temperature. The ATS-08C-207-C3-R0 is highly efficient and has a low thermal resistance, allowing it to dissipate more heat per unit of area.
The ATS-08C-207-C3-R0 also features a low profile design which makes it suitable for tight spaces. Its mounting system makes it easy to install and its aluminum construction makes it highly durable. It also features pre-drilled mounting holes for easy installation. As such, it is ideal for thermal management applications in a variety of systems and devices.
Conclusion
The ATS-08C-207-C3-R0 is an effective thermal-heat sink that can be used to cool down components in a variety of applications. It employs thermal transfer principles to absorb and diffuse heat away from the source, allowing it to remain cooler and operate more efficiently. It also has a low profile design, making it suitable for tight spaces, and features pre-drilled mounting holes for easy installation. As such, it is a highly efficient, durable, and easy-to-install solution for thermal management.
The specific data is subject to PDF, and the above content is for reference