| Allicdata Part #: | ATS-08C-25-C1-R0-ND |
| Manufacturer Part#: |
ATS-08C-25-C1-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-25-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.32621 |
| 30 +: | $ 4.08555 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are ubiquitous in get today\'s world of electronics. The ATS-08C-25-C1-R0 is an efficient, medium capacity thermal heat sink ideal for cooling a wide range of electronics components such as integrated circuits, transistors, and thermal management devices. This product is engineered to provide the best possible heat removal efficiency for its size and price category.
This heat sink is designed to dissipate heat generated by electrical or electronic components, which are placed on top and in close proximity to it. It is made of aluminum, which is one of the best materials used in the industry for heat dissipation. It also has a black anodized finish, which provides greater thermal efficiency. Additionally, it’s equipped with a fan, which helps to reduce temperature and noise.
As far as its applications go, this heat sink can be used in a variety of thermal management applications in the electronics industry. For example, it is suitable for use in the thermal management of semi-conductor chips in large and complex multi-core processors. In these systems, the heat sink acts as a cooling element that helps to reduce the overall temperature of the processor, thus enabling it to run at optimal levels. It is also suitable for use in a range of other electronics applications, such as medical devices, industrial robotics, automotive electronics and drones.
In terms of its working principle, this heat sink works by dissipating the heat generated by the components that are placed near it. It is composed of a finned surface that consists of small heat conducting channels in between layers of heat generating elements. When an electronic component generates heat, this heat is transferred to the heat sink through conduction. The heat sink then dissipates the heat through the fins, which creates a cooling effect. Since the fins are exposed to the air, they can dissipate the heat more quickly than if they were enclosed in a box.
The ATS-08C-25-C1-R0 is an efficient, medium capacity thermal heat sink that is suitable for a variety of thermal management applications. It is designed to dissipate heat generated by electrical or electronic components, which are placed on top and in close proximity to it. Additionally, it is equipped with a fan that helps to reduce temperature and noise. The working principle of this heat sink involves dissipating the heat generated by the components through its finned surface, which creates a cooling effect in the surrounding environment.
The specific data is subject to PDF, and the above content is for reference