ATS-08C-44-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.62°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are a type of heat sink developed to manage the temperature of heat generating components in power systems, such as transistors. They are designed to eliminate static electricity, dissipate heat and protect the components. The ATS-08C-44-C3-R0 is a thermal - heat sink specifically designed to handle extreme temperatures generated by transistor-level components.

Design and Specifications

The ATS-08C-44-C3-R0 is a small, open frame thermal - heat sink. It measures 44 mm by 34 mm and is 2.5 mm thick. It has a flat external fin structure that increases the surface area and provides a large convection area for efficient heat dissipation. The fins are 2 mm thick and feature a convex hole design to reduce air resistance and increase flow. The sink is made of aluminum and features an anodized black oxide finish for improved durability.

Application Field and Working Principle

The ATS-08C-44-C3-R0 is designed primarily for transistor-level components, such as logic gates and amplifiers, that operate in high-temperature environments. It is also suitable for use on industrial controllers and circuit boards that require thermal management.The ATS-08C-44-C3-R0 works by transferring heat away from hot components through conduction and convection. The fins act as a heat sink to dissipate heat from the transistor-level components and the anodized black oxide finish helps to improve the thermal conductivity. Heat is transferred from the components to the fins through conduction, and the increased surface area of the fins provides an increased area for the transmission of heat through convection.

Advantages of the ATS-08C-44-C3-R0

The ATS-08C-44-C3-R0 provides several advantages over conventional thermal - heat sinks. Its small size and low profile make it suitable for use in high-temperature environments where space is limited. The anodized black oxide finish increases the thermal conductivity of the heat sink, allowing it to dissipate more heat in less time. In addition, the flat external fin structure and convex hole design reduce air resistance and increase flow, resulting in improved heat dissipation.

Conclusion

The ATS-08C-44-C3-R0 is a small, open frame thermal - heat sink designed for use in high-temperature environments. Its small size and low profile make it suitable for use where space is limited, while the anodized black oxide finish, flat external fin structure and convex hole design improve thermal conductivity and increase flow for improved heat dissipation. The ATS-08C-44-C3-R0 is ideal for transistor-level components, such as logic gates and amplifiers, as well as industrial controllers and circuit boards that require thermal management.

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