ATS-08C-47-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08C-47-C1-R0-ND

Manufacturer Part#:

ATS-08C-47-C1-R0

Price: $ 3.65
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X30MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08C-47-C1-R0 datasheetATS-08C-47-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.31695
30 +: $ 3.22707
50 +: $ 3.04781
100 +: $ 2.86858
250 +: $ 2.68930
500 +: $ 2.59965
1000 +: $ 2.33071
Stock 1000Can Ship Immediately
$ 3.65
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.24°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical engineering concern for the design and operation of electronics-based systems. As electrical current flows through resistive components, the system generates heat. Without any form of cooling, the heat gradually builds up and system components can be severely damaged.

Heat sinks are devices used to dissipate heat from a system. Heat sinks absorb heat from a component or system and transfer it to another medium, usually air or a fluid. The air or fluid can then be moved away from the components using fans or pumps. Heat sinks come in many shapes and forms, and each type has different characteristics that make it suitable for different applications.

The ATS-08C-47-C1-R0 is a type of thermal heat sink designed for embedded electronics systems. It is anodized aluminum heat sink with integrated natural convection fins. The heat sink can dissipate up to 8W of power at a maximum temperature of 85 °C. The fins are designed to increase the surface area exposed to air, thus allowing for efficient heat dissipation.

The ATS-08C-47-C1-R0 is ideally suited for applications where high levels of thermal dissipation and low noise are required. The fin design ensures that the heat sink is able to dissipate heat quickly and quietly without any additional cooling fans. This makes it ideal for small form factor electronics, such as embedded computers, game consoles and small office computers.

The ATS-08C-47-C1-R0 also has a wide range of applications in industrial electronics, including broadcast equipment, medical imaging and power control systems. The heat sink has also been used in gaming consoles to improve performance and reduce the amount of heat generated. This makes it perfect for use with high performance processors, as the heat sink can absorb and dissipate heat quickly, thus keeping the system cool.

The ATS-08C-47-C1-R0 is designed to work by creating a natural convection of air across its surface. This is achieved by forcing hot air away from the heat source with the help of the fins. This process allows the sink to absorb and dissipate heat efficiently and quickly. The fins also help to reduce the amount of airflow needed to keep the system cool, thus reducing fan noise.

The ATS-08C-47-C1-R0 provides superior thermal performance compared to other passive heat sinks. Its anodized aluminum construction ensures a strong, durable heat sink that is able to dissipate heat more quickly than other material. It is also resistant to corrosion and oxidation, making it ideal for a range of industrial and home applications.

The ATS-08C-47-C1-R0 is an efficient and reliable thermal heat sink that is ideal for embedded and industrial electronics applications. Its fin design ensures efficient heat dissipation without the need for additional cooling fans, while its rugged construction ensures a long-lasting solution. This makes it perfect for applications where the system needs to remain cool over a long period of time.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics