| Allicdata Part #: | ATS14271-ND |
| Manufacturer Part#: |
ATS-08C-48-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-48-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49335 |
| 25 +: | $ 3.29918 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have been used for many years to facilitate heat transfer from electronic components. The purpose of a heat sink is to provide a way for the heat generated by a component to be dissipated into the surrounding atmosphere. One of the most commonly used types of heat sink is the ATS-08C-48-C2-R0.
The ATS-08C-48-C2-R0 is a solid-state heat sink of aluminum construction which currently holds UL recognition. It consists of a processor die pad, two rows of thermal fins, and four screws for attaching it to a hardware component. It is suitable for a range of voltages and has several advantages over other types of heat sinks such as ease of installation, low profile, and good heat conductivity.
The main application field of the ATS-08C-48-C2-R0 is in cooling systems for computer and other electronic equipment. The device is able to dissipate heat from hot spots generated within the housing of the device. It is also commonly used in high power applications such as servers and network routers. Another possible use of the ATS-08C-48-C2-R0 is in the cooling of FPGAs, ASICs and other high-density components.
The working principle of the ATS-08C-48-C2-R0 is based on the idea of forced convection, or air cooling. Forced convection occurs when air is forced across a surface in order to speed up the rate at which heat is transferred. This is accomplished through the use of electric fans or other air movers. The ATS-08C-48-C2-R0 works by taking in air from the surroundings and pushing it across the component that is being cooled. As the air passes over the component, it cools the component down.
The ATS-08C-48-C2-R0 is a highly effective solution to the problem of overheating in electronic devices. It is easy to install, has a low profile, and provides good heat conductivity. It is suitable for a range of applications and voltages, making it the ideal choice for those looking for a reliable and efficient heat sink solution.
The specific data is subject to PDF, and the above content is for reference