| Allicdata Part #: | ATS-08C-61-C3-R0-ND |
| Manufacturer Part#: |
ATS-08C-61-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-61-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions have become increasingly important as electronic components have become increasingly miniaturized and their power density has increased. Heat dissipation is essential in electronics to maintain optimal operating temperatures and is a critical factor in the longevity of the component. One solution used to disperse heat is the ATS-08C-61-C3-R0, which is a thermal heat sink specifically designed to improve the thermal performance of electronics by dissipating heat from the surface of the component into the surrounding environment.
The ATS-08C-61-C3-R0 is a finned heat sink designed to dissipate large amounts of heat from electronic components and dissipate it into the environment. This heat sink utilizes a compact internal structure and a fin-reinforced heat-sink base. It consists of a number of fins which increase the contact area between the heat sink and the air, thus allowing the heat to be quickly and evenly dissipated. The fins also provide additional support for the heat sink, ensuring that it remains securely in place and is not likely to fail.
The ATS-08C-61-C3-R0 is composed of two components, the heat sink base and the fins. The heat sink base is made of a thermally conductive material to ensure that heat is quickly and uniformly transferred from the component to the fins. The fins are made of a highly efficient thermal material, which helps to quickly transfer the heat off the component and into the surrounding air. This material has a low thermal resistance, ensuring the heat can be quickly dissipated. The heat sink base also features a low profile design, allowing it to easily fit into tight spaces, as well as a clip-on design that makes installation easy.
The ATS-08C-61-C3-R0 is ideal for use in electronics such as CPUs, GPUs, memory chips, graphics cards, and motherboards. It is also suitable for use in power supplies and other high power electronics. The heat sink has a variety of applications, such as eliminating hot spots in components, reducing the temperature of components in enclosed spaces, and promoting longevity in electronics.
The ATS-08C-61-C3-R0 is an effective and reliable thermal management product. It has proven successful in improving the thermal performance of electronics and significantly reducing both temperature and noise levels. It is a highly efficient way of dissipating heat away from components and has been designed to last over long periods of time.
The specific data is subject to PDF, and the above content is for reference