| Allicdata Part #: | ATS-08C-64-C3-R0-ND |
| Manufacturer Part#: |
ATS-08C-64-C3-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-64-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.92112 |
| 30 +: | $ 3.70335 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.49°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are heat exchangers that are commonly used to cool various electronic components and systems. The ATS-08C-64-C3-R0 is a type of heat sink that is particularly effective when used for cooling applications such as high performance processors, memory modules, and other sensitive electrical components. This article will discuss the application field and working principle of the ATS-08C-64-C3-R0.
The ATS-08C-64-C3-R0 is designed to be used in a variety of applications, such as circuit boards, power supplies, and other types of computer components that require effective cooling. It features a copper laminated core and a highly reflective aluminum shell that allows it to dissipate heat quickly and efficiently. In order to ensure that the thermal performance of the ATS-08C-64-C3-R0 is consistent and reliable, it has been designed and manufactured with precision to ensure that all of its components are perfectly aligned.
The ATS-08C-64-C3-R0 operates using thermal convection. This simply means that when hot air is generated, it is pushed away from the component by a fan or other device, and cold air is drawn in to replace it. This process helps to keep the electronic components cool, as the air that is being pulled in is much cooler than the air that is being pushed away. As the air is expelled, it is quickly replaced with cooler air, thus increasing the overall cooling efficiency of the system. The ATS-08C-64-C3-R0 also features a fin design that helps to maximize the air flow through the heat sink, and ensure that the components remain cool.
In addition to its thermal convection properties, the ATS-08C-64-C3-R0 also includes an intelligent temperature monitoring system. This system monitors the temperature of the component that is being cooled, and will automatically adjust the fan speed to ensure that the component remains at the desired temperature. This is particularly useful when cooling components that generate a large amount of heat, such as CPUs and GPUs.
The ATS-08C-64-C3-R0 is one of the most reliable and effective heat sinks on the market, and is well-suited for use in a variety of applications. Its copper laminated core and highly reflective aluminum shell keeps the components cool, and its intelligent temperature monitoring system ensures that the components remain at a safe temperature. The ATS-08C-64-C3-R0 is a great choice for any application that requires an effective and efficient heat sink.
The specific data is subject to PDF, and the above content is for reference