| Allicdata Part #: | ATS-08C-75-C3-R0-ND |
| Manufacturer Part#: |
ATS-08C-75-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-75-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become increasingly important in the modern industrial and consumer electronics landscape, where small component sizes and faster computing mean more units of heat generated per unit volume. The ATS-08C-75-C3-R0 is a type of heat sink that helps manage thermals in these applications by providing efficient heat dissipation.
The ATS-08C-75-C3-R0 is a type of extruded aluminum heat sink that features an exposed copper base. The exposed base provides an efficient thermal interface between the heat source and the aluminum body. This allows for much greater heat dissipation than conventional aluminum heat sinks that do not feature an exposed copper base. The ATS-08C-75-C3-R0 also features a raised profile design that allows for a greater surface area for improved air circulation and convection cooling. It also features rounded corners and edges that reduce turbulence, improving heat dissipation.
The ATS-08C-75-C3-R0 is widely used in the industrial and consumer electronics markets due to its efficient heat dissipation. In industrial applications, it is often used to cool critical components such as CPUs, GPUs, memory, power regulators, and other sensitive components. In consumer electronics, it is often used to cool gaming consoles, laptops, and other electronics that generate heat. It is also often used in telecommunications, LED lighting, and medical imaging applications.
The ATS-08C-75-C3-R0 is designed to work in conjunction with fans or other air flow solutions to effectively dissipate heat from its surface. The aluminum body provides a large heat dissipation area, and the exposed copper base serves as an efficient thermal interface between the heat source and the aluminum body. The raised profile design also helps to increase the downward air breeze through the heat sink, as well as providing extra surface area for increased air circulation and convection cooling. In addition, the rounded corners and edges reduce turbulence, further improving heat dissipation.
The ATS-08C-75-C3-R0 is a reliable and efficient heat sink solution for industrial and consumer electronics applications. With its exposed copper base and raised design, it provides an efficient thermal interface between the heat source and the aluminum body and increased air circulation and convection cooling. The rounded corners and edges reduce turbulence and improve heat dissipation, making it a reliable and efficient heat sink solution for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference